HSM223C

Features: · Low capacitance, proof against high voltage.· Fast recovery time.· MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Peak reverse voltage VRM 85 V Reverse voltage VR 80 ...

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HSM223C Picture
SeekIC No. : 004366149 Detail

HSM223C: Features: · Low capacitance, proof against high voltage.· Fast recovery time.· MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item ...

floor Price/Ceiling Price

Part Number:
HSM223C
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

·  Low capacitance, proof against high voltage.
·  Fast recovery time.
·  MPAK package is suitable for high density surface mounting and high speed assembly.



Pinout

  Connection Diagram


Specifications

Item
Symbol
Value
Unit
Peak reverse voltage
VRM
85
V
Reverse voltage
VR
80
V
Peak forward current
IFM
300
mA
Non-Repetitive peak forward surge current
IFSM*
4
A
Average forward current
IO
100
mA
Junction temperature
Tj
125
Storage temperature
Tstg
55 to +125

Note: Within 1s forward surge current.


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