Features: · Low forward resistance. (rf = 0.9 max)· Low capacitance. (C = 1.2pFmax)· MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Reverse voltage VR 35 V Power dissipation PD 150 ...
HSM2692: Features: · Low forward resistance. (rf = 0.9 max)· Low capacitance. (C = 1.2pFmax)· MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications It...
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Item |
Symbol |
Value |
Unit |
Reverse voltage |
VR |
35 |
V |
Power dissipation |
PD |
150 |
mW |
Junction temperature |
Tj |
125 |
|
Storage temperature |
Tstg |
45 to +125 |
|
Operation temperature |
Topr |
20 to +60 |