Features: • Subminiature Flat Top and Dome Package Size 2x2 mm• IR Emitter 875 nm TS AlGaAs Intensity 17 mW/sr Speed 40 ns• Wide Range of Drive Currents 500 mA to 500 mA• IR Detector PIN Photodiode High Sensitivity Speed 7.5 ns• Flexible Lead Configurations Surfac...
HSDL-54xx: Features: • Subminiature Flat Top and Dome Package Size 2x2 mm• IR Emitter 875 nm TS AlGaAs Intensity 17 mW/sr Speed 40 ns• Wide Range of Drive Currents 500 mA to 500 mA• ...
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Features: `Fully Compliant to IrDA Physical Layer Speciication 1.4 from 9.6 kbit/s to 115.2 kbit/...
Parameter | Symbol | Min. | Max. | Unit | Ref. |
Peak Forward Current (Duty Factor = 20%,ulse Width = 100 s) |
IFPK | 500 | mA | Fig. 7, 8 | |
DC Forward Current | IFDC | 100 | mA | Fig. 6 | |
Power Dissipation | PDISS | 100 | mW | ||
Reverse Voltage (IR = 100 A) | VR | 5 | V | ||
Transient Forward Current (10 s Pulse) | IFTR | 1.0 | A | [1] | |
Operating Temperature | TO | -40 | 85 | ||
Storage Temperature | TS | -55 | 100 | ||
Junction Temperature | TJ | 110 | |||
Lead Solder Temperature [1.6 mm (0.063 in.) from body] |
260/5 s | ||||
Reflow Soldering Temperatures Convection IR Vapor Phase |
235/90 s 215/180 s |
Fig. 20 |
Flat Top Package
The HSDL-54xx Series of flat top IR emitters use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is useful for short distance communication where alignment of the emitter and detector is not critical. The HSDL-5400 Series of flat top IR detectors uses the same truncated lens design as the HSDL-4400 Series of IR emitters with the added feature of a black tint that acts as an optical filter to reduce the effects of ambient light, such as sun, incandescent and fluorescent light from interfering with the IR signal.
Dome Package
The HSDL-54xx Series of dome IR emitters uses an untinted, nondiffused lens to provide a 24 degree viewing angle with high on-axis intensity. The HSDL-5420 Series of IR detectors uses the same lens design as the HSDL- 4420 IR emitter and optical filter used in the HSDL-5400 IR detector.
Lead Configuration
All of these HSDL-54xx devices are made by encapsulating LED and PIN photodiode chips on axial lead frames to form molded epoxy subminiature packages. A variety of lead configurations is available and includes: surface mount gull wing, yoke lead, or Z-bend and through hole lead bends at 2.54 mm (0.100 inch) center spacing.
Technology of HSDL-54xx
The subminiature solid state emitters utilize a highly optimized LED material, transparent substrate aluminum gallium arsenide, TS AlGaAs. This material has a very high radiant efficiency, capable of producing high light output over a wide range of drive currents and temperature.