Features: • Part IdentificationHSD8M32F4V :Height from bottom to top 11.3mmHSD8M32F4VA :Height from bottom to top 7.3mm• Burst mode operation• Auto & self refresh capability (4096 Cycles/64ms)• LVTTL compatible inputs and outputs• Single 3.3V ±0.3V power supply...
HSD8M32F4V: Features: • Part IdentificationHSD8M32F4V :Height from bottom to top 11.3mmHSD8M32F4VA :Height from bottom to top 7.3mm• Burst mode operation• Auto & self refresh capability (4...
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PARAMETER |
SYMBOL |
RATING |
Voltage on any pin relative to VSS |
VIN, VOUT |
-0.5 ~ 3.6 |
Voltage on VCC supply relative to VSS |
Vcc |
-1.0 ~ 3.6 |
Power Dissipation |
PD |
8 |
Storage Temperature |
TSTG |
-55 ~ +150 |
Short Circuit Current |
IOS |
50 |
The HSD8M32F4V/VA is a 8M x 32 bit Synchronous Dynamic RAM high density memory module. The module consists of four CMOS 8M x 8 bit with 4banks Synchronous DRAMs in TSOP-II packages is mounted on a 120-pin, single-sided, FR-4-printed circuit board., Two 0.1uF decoupling capacitors are mounted on the printed circuit board in parallel for each SDRAM. The HSD8M32F4V/VA is a SMM (Stackable Memory Module) designed and is intended for mounting into two 60- pin connector sockets. Synchronous design allows precise cycle control with the use of system clock. I/O ansactions are possible on every clock cycle. Range of operating frequencies, programmable latencies allows the same device to be useful for a variety of high bandwidth, high performance memory system applications All module components may be powered from a single 3.3V DC power supply and all inputs and outputs are LVTTL-compatible.