Features: · Access time : 70, 85, 120, 150ns· High-density design : 256KByte Design· Battery internally isolated until power is applied· Industry-standard 40-pin 128K x 16 pinout· Unlimited write cycles· Data retention in the absence of VCC· 10-years minimum data retention in absence of power· Aut...
HMN12816D: Features: · Access time : 70, 85, 120, 150ns· High-density design : 256KByte Design· Battery internally isolated until power is applied· Industry-standard 40-pin 128K x 16 pinout· Unlimited write cy...
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PARAMETER |
SYMBOL |
RATING |
CONDITIONS |
DC voltage applied on VCC relative to VSS |
VCC |
-0.3V to 7.0V |
|
DC Voltage applied on any pin excluding VCC relative to VSS |
VT |
-0.3V to 7.0V |
VT VCC+0.3 |
Operating temperature |
TOPR |
0 to 70°C |
|
Storage temperature |
TSTG |
-40°C to 70°C |
|
Temperature under bias | TBIAS | -10°C to 70°C | |
Soldering temperature |
TSOLDER |
260°C |
For 10 second |
The HMN12816D 128K x 16 nonvolatile SRAM's are 2,097,152-bit fully static, nonvolatile SRAM's, organized as 131,072 words by 16 bits. Each NVSRAM has a self contained lithium energy source and control circuitry which constantly monitors Vcc for an out-of-tolerance condition. When such a condition occurs, the lithium energy source is automatically switched on and write protection is unconditionally enabled to prevent data corruption. DIP-package HMN12816D devices can be used in place of solutions which build nonvolatile 128Kx16 memory by utilizing a variety of discrete components. There is no limit on the number of write cycles that can be executed and no additional support circuitry is required for microprocessor interfacing.
The HMN12816D uses extremely low standby current CMOS SRAM's, coupled with small lithium coin cells to provide nonvolatility without long write-cycle times and the write-cycle limitations associated with EEPROM.