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HMMC-2027

Features: • Outputs Terminated in 50 W When Off• Frequency Range: DC- 26.5ÊGHz• Insertion Loss: 2.5dB @ 26.5 GHz• Isolation: >70 dB @ 45 MHz30 dB @ 26.5 GHz• Return Loss: 15 dB (Both Input and Selected Output) 12 dB Unselected Output• Switching Speed: &...

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SeekIC No. : 004364714 Detail

HMMC-2027: Features: • Outputs Terminated in 50 W When Off• Frequency Range: DC- 26.5ÊGHz• Insertion Loss: 2.5dB @ 26.5 GHz• Isolation: >70 dB @ 45 MHz30 dB @ 26.5 GHz• R...

HMMC-2027 Data Sheet

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Part Number:
HMMC-2027
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Outputs Terminated in 50 W When Off
• Frequency Range: DC- 26.5ÊGHz
• Insertion Loss: 2.5dB @ 26.5 GHz
• Isolation: >70 dB @ 45 MHz
                    30 dB @ 26.5 GHz
• Return Loss: 15 dB (Both Input and Selected Output)
                       12 dB Unselected Output
• Switching Speed: <1 ns (10%-90% RF)
• P-1dB: 18 dBm @ 10 MHz
              27 dBm @ 2 GHz
• Harmonics (DC Coupled):
    <-45 dBc @ 10 MHz and 5 dBm
    <-65 dBc @ 2 GHz and 5 dBm


Application

The HMMC-2027 can be used in instrumentation, communications, radar, ECM, EW, and many other systems requiring SPDT switching. It can be used for pulse modulation, port isolation, transfer switching, high-speed switching, replacement of mechanical switches, and so on.




Specifications

 

Symbol
Parameters/Conditions
Units
Min.
Max.
Vsel
 Select Voltages 1 and 2
V
-10.5
+3
Pin
 RF Input Power
dBm
25
Top
 Operating Temperature
-55
+125
TSTG
 Storage Temperature
-65
+165
Tmsx
 Maximum Assembly Temp.
+200
Punsel[2]
 Power into Unselected Output
dBm
15




Description

The HMMC-2027 is a GaAs monolithic microwave integrated circuit (MMIC) designed for low insertion loss and high isolation from DC to 26.5 GHz. It is intended for use as a generalpurpose, single-pole, doublethrow (SPDT), absorptive switch. Two series and two shunt MESFETs per throw provide 3 dB maximum insertion loss and 30ÊdB minimum isolation at 26.5ÊGHz. HMMC-2027 chips use through-substrate vias to provide ground connections to the chip backside and minimize the number of wire bonds required.




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