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HMD8M36M18G

Features: ·Part Identification HMD8M36M18---- 2048 Cycles/32ms Ref. Solder Lead HMD8M36M18G-- 2048 Cycles/32ms Ref. Gold Lead·Access times : 50, 60ns·High-density 32MByte design·Single + 5V ±0.5V power supply·JEDEC standard PDpin and pinout·Fast Page with Parity mode operation·/CAS-before-/RAS ref...

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SeekIC No. : 004364644 Detail

HMD8M36M18G: Features: ·Part Identification HMD8M36M18---- 2048 Cycles/32ms Ref. Solder Lead HMD8M36M18G-- 2048 Cycles/32ms Ref. Gold Lead·Access times : 50, 60ns·High-density 32MByte design·Single + 5V ±0.5V po...

HMD8M36M18G Data Sheet

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Part Number:
HMD8M36M18G
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

·Part Identification
   HMD8M36M18---- 2048 Cycles/32ms Ref. Solder Lead
   HMD8M36M18G-- 2048 Cycles/32ms Ref. Gold Lead
·Access times : 50, 60ns
·High-density 32MByte design
·Single + 5V ±0.5V power supply
·JEDEC standard PDpin and pinout
·Fast Page with Parity mode operation
·/CAS-before-/RAS refresh capability
·/RAS-only and Hidden refresh capability
·TTL compatible inputs and outputs
·FR4-PCB design


Specifications

PARAMETER
SYMBOL
RATING
Voltage on Any Pin Relative to Vss
VIN ,OUT
-1V to 7.0V
Voltage on Vcc Supply Relative to Vss
Vcc
-1V to 7.0V
Power Dissipation
PD
18W
Storage Temperature
TSTG
-55 to 150
Short Circuit Output Current
IOS
50mA

*Permanent device damage may occur if " Absolute Maximum Ratings" are exceeded. Functional operation should be
restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.




Description

The HMD8M36M18G is a 8M x 36bit dynamic RAM high density memory module.

The module HMD8M36M18G consists of sixteen CMOS 4M x 4bit DRAM in 24-pin SOJ packages and two CMOS 4Mx 4bit Quad-CAS DRAM in 28pin SOJ packages mounted on a 72-pin, double-sided, FR-4-printed circuit board. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM components.

The module HMD8M36M18G is a single In-line Memory Module with edge connections and is intended for mounting in to 72-pin edge connector sockets. All module components may be powered from a single 5V DC power supply and all inputs and outputs are TTL-compatible.




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