Features: ·Part IdentificationHMD8M32M4----4K Cycles/64ms Ref, SolderHMD8M32M4G- 4K Cycles/64ms Ref, Gold·Access times : 50, 60ns·High-density 32MByte design·Single +5V ±0.5V power supply·JEDEC Standard pinout·Fast Page mode operation·TTL compatible inputs and outputs·FR4-PCB designSpecifications ...
HMD8M32M4G: Features: ·Part IdentificationHMD8M32M4----4K Cycles/64ms Ref, SolderHMD8M32M4G- 4K Cycles/64ms Ref, Gold·Access times : 50, 60ns·High-density 32MByte design·Single +5V ±0.5V power supply·JEDEC Stan...
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Features: ·Access times : 50, 60ns·High-density 32MByte design·Single +5V ± 0.5V power supply·JEDE...
Features: ·Part Identification HMD8M32M4E----4K Cycles/64ms Ref. Solder HMD8M32M4EG- 4K Cycles/64m...
Features: ·Part Identification HMD8M36M18---- 2048 Cycles/32ms Ref. Solder Lead HMD8M36M18G-- 2048...
PARAMETER |
SYMBOL |
RATING |
Voltage on Any Pin Relative to Vss Voltage on Vcc Supply Relative to Vss Power Dissipation Storage Temperature Short Circuit Output Current |
VIN ,OUT Vcc PD TSTG IOS |
-1V to 7.0V -1V to 7.0V 4W -55 to 150 50mA |
`Permanent device damage may cur if " Absolute Maximum Ratings" are exceeded. Functional operation should be
restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
The HMD8M32M4G is a 8M x 32bit dynamic RAM high density memory module. The module consists of four CMOS 4M x 16 bit DRAMs in 50-pin TSOP packages mounted on a 72-pin, double-sided, FR-4-printed circuit board. A 0.1uF or 0.22uF
decoupling capacitor is mounted on the printed circuit board for each DRAM components. The module HMD8M32M4G is a single In-line memory module with edge connections and is intended for mounting in to 72-pin edge connector sockets. All module components may be powered from a single 5V DC power supply and all inputs and outputs are TTL-compatible.