DescriptionThe HMD4M72D18G is a 4Mx72bits Dynamic RAM high density memory module. The device consists of eighteen CMOS 4Mx4bits DRAMs in SOJ/TSOPII 400mil packages mounted on a 168-pin glass-epoxy substrate. It is a Dual In-line Memory Module and is intended for mounting into 168 pin edge connecto...
HMD4M72D18G: DescriptionThe HMD4M72D18G is a 4Mx72bits Dynamic RAM high density memory module. The device consists of eighteen CMOS 4Mx4bits DRAMs in SOJ/TSOPII 400mil packages mounted on a 168-pin glass-epoxy s...
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Features: Access times : 50, 60 ns w Timing High -density 64MByte design 50ns access -5Part ident...
Features: · Part Identification HMD4M32M2E----4K Cycles/64ms Ref. Solder HMD4M32M2EG- 4K Cycles/64...
The HMD4M72D18G is a 4Mx72bits Dynamic RAM high density memory module. The device consists of eighteen CMOS 4Mx4bits DRAMs in SOJ/TSOPII 400mil packages mounted on a 168-pin glass-epoxy substrate. It is a Dual In-line Memory Module and is intended for mounting into 168 pin edge connector sockets.
The features of HMD4M72D18G can be summarized as:(1)High-density 32MByte design ; (2)New JEDEC standard proposal without buffer; (3)CAS-before-RAS Refresh capability ; (4)RAS-only and Hidden refresh capability ; (5)Single +5± 0.5V power supply; (6)Fast Page mode operation.; (7)LVTTL compatible inputs and outputs; (8)FR4-PCB design; (9)Access times : 50, 60ns.
The absolute maximum ratings of HMD4M72D18G are:(1)Voltage on Any Pin Relative to Vss:-0.5V to 4.6V ; (2)Voltage on Vcc Supply Relative to Vss:-0.5V to 4.6V ; (3)Power Dissipation:18W ; (4)Storage Temperature:-55°C to 150°C; (5)Short Circuit Output Current:50mA.
If you want to know more information such as the electrical characteristics about the HMD4M72D18G, please download the datasheet in www.seekic.com or www.chinaicmart.com .