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HMD4M72D18EG

Features: · Part Identification HMD4M72D18EG --- 4KCycles/64ms Ref, Gold Plate Lead· High-density 32MByte design· New JEDEC standard proposal without buffer· CAS-before-RAS Refresh capability· RAS-only and Hidden refresh capability· Single +5± 0.5V power supply w Timing· EDO mode operation. 50ns a...

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SeekIC No. : 004364635 Detail

HMD4M72D18EG: Features: · Part Identification HMD4M72D18EG --- 4KCycles/64ms Ref, Gold Plate Lead· High-density 32MByte design· New JEDEC standard proposal without buffer· CAS-before-RAS Refresh capability· RAS-o...

HMD4M72D18EG Data Sheet

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Part Number:
HMD4M72D18EG
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

· Part Identification HMD4M72D18EG --- 4KCycles/64ms Ref, Gold Plate Lead
· High-density 32MByte design
· New JEDEC standard proposal without buffer
· CAS-before-RAS Refresh capability
· RAS-only and Hidden refresh capability
· Single +5± 0.5V power supply w Timing
· EDO mode operation. 50ns access -5
· LVTTL compatible inputs and outputs 60ns access -6
· FR4-PCB design w Packages
· Access times : 50, 60ns 168-pin DIMM D


Specifications

PARAMETER SYMBOL RATING
Voltage on Any Pin Relative to Vss VIN ,OUT -0.5V to 4.6V
Voltage on Vcc Supply Relative to Vss Vcc -0.5V to 4.6V
Power Dissipation PD 18W
Storage Temperature TSTG -55 to 150
Short Circuit Output Current IOS 50mA

w Permanent device damage may occur if " Absolute Maximum Ratings" are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.




Description

The HMD4M72D18EG is a 4Mx72bits Dynamic RAM high density memory module. It consists of eighteen CMOS 4Mx4bits DRAMs in SOJ/TSOPІІ 400mil packages mounted on a 168-pin glass-epoxy substrate. A 0.1 or
0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM. It is a Dual Inline Memory Module and is intended for mounting into 168 pin edge connector sockets




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