Features: Part Identification HMD4M64D16E --- 4KCycles/64ms Ref, Gold Plate LeadHigh-density 32MByte designNew JEDEC standard proposal without bufferCAS-before-RAS Refresh capabilityRAS-only and Hidden refresh capabilitySingle +5± 0.5V power supplyEDO mode operation.LVTTL compatible inputs and out...
HMD4M64D16E: Features: Part Identification HMD4M64D16E --- 4KCycles/64ms Ref, Gold Plate LeadHigh-density 32MByte designNew JEDEC standard proposal without bufferCAS-before-RAS Refresh capabilityRAS-only and Hid...
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Features: Access times : 50, 60 ns w Timing High -density 64MByte design 50ns access -5Part ident...
Features: · Part Identification HMD4M32M2E----4K Cycles/64ms Ref. Solder HMD4M32M2EG- 4K Cycles/64...
PARAMETER |
SYMBOL |
RATING |
Voltage on Any Pin Relative to Vss |
VIN ,OUT |
-0.5V to 4.6V |
Voltage on Vcc Supply Relative to Vss |
Vcc |
-0.5V to 4.6V |
Power Dissipation |
PD |
18W |
Storage Temperature |
TSTG |
-55oC to 150oC |
Short Circuit Output Current |
IOS |
50mA |
The HMD4M64D16E is a 4Mx64bits Dynamic RAM high density memory module. It consists of sixteen CMOS 4Mx4bits DRAMs in SOJ/TSOPІІ 400mil packages mounted on a 168-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM. It is a Dual In-line Memory Module and is intended for mounting into 168 pin edge connector sockets