Features: · Part IdentificationHMD4M36M9E----2048 Cycles/32ms Ref. SolderHMD4M36M9EG- 2048 Cycles/32ms Ref. GoldHMD4M36M9EA----4096 Cycles/64ms Ref. SolderHMD4M36M9EAG- 4096 Cycles/64ms Ref. Gold· Access times : 50, 60ns· High-density 16MByte design· Single + 5V ±0.5V power supply· JEDEC standard ...
HMD4M36M9EG: Features: · Part IdentificationHMD4M36M9E----2048 Cycles/32ms Ref. SolderHMD4M36M9EG- 2048 Cycles/32ms Ref. GoldHMD4M36M9EA----4096 Cycles/64ms Ref. SolderHMD4M36M9EAG- 4096 Cycles/64ms Ref. Gold· A...
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Features: Access times : 50, 60 ns w Timing High -density 64MByte design 50ns access -5Part ident...
Features: · Part Identification HMD4M32M2E----4K Cycles/64ms Ref. Solder HMD4M32M2EG- 4K Cycles/64...
PARAMETER | SYMBOL | RATING |
Voltage on Any Pin Relative to Vss | VIN ,OUT | -1V to 7.0V |
Voltage on Vcc Supply Relative to Vss | Vcc | -1V to 7.0V |
Power Dissipation | PD | 9W |
Storage Temperature | TSTG | -55 to 150 |
Short Circuit Output Current | IOS | 50mA |
w Permanent device damage may occur if " Absolute Maximum Ratings" are exceeded. Functional operation should be
restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
The HMD4M36M9EG is a 4M x 36 bit dynamic RAM high-density memory module. The module HMD4M36M8E consists f eight CMOS 4M x 4 bit DRAMs in 24-pin SOJ packages and one CMOS 4M x 4 bit Quad /CAS DRAM in 28-pin SOJ ackage mounted on a 72-pin, double-sided, FR-4-printed circuit board.
A 0.1uF or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM. The module HMD4M36M9EG is a single Inline emory module with edge connections and is intended for mounting in to 72-pin edge connector sockets. ll odule components may be powered from a single 5V DC power supply and all inputs and outputs are TTL - mpatible.