Features: · Part IdentificationHMD4M32M2VE----Lead finish SolderHMD4M32M2VEG- Lead finish Gold· Access times : 50, 60ns· High-density 16MByte design· 4K Cycles/64ms Ref, Gold· Single +3.3V± 0.3V power supply·JEDEC standard pinout· EDO Mode operation· LVTTL compatible inputs and outputs· FR4-PCB de...
HMD4M32M2VE: Features: · Part IdentificationHMD4M32M2VE----Lead finish SolderHMD4M32M2VEG- Lead finish Gold· Access times : 50, 60ns· High-density 16MByte design· 4K Cycles/64ms Ref, Gold· Single +3.3V± 0.3V pow...
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Features: Access times : 50, 60 ns w Timing High -density 64MByte design 50ns access -5Part ident...
Features: · Part Identification HMD4M32M2E----4K Cycles/64ms Ref. Solder HMD4M32M2EG- 4K Cycles/64...
PARAMETER | SYMBOL | RATING |
Voltage on Any Pin Relative to Vss | VIN ,OUT | -0.5V to 6.5V |
Voltage on Vcc Supply Relative to Vss | Vcc | -0.5V to 4.6V |
Power Dissipation | PD | 2W |
Storage Temperature | TSTG | -55 to 150 |
Short Circuit Output Current | IOS | 50mA |
` Permanent device damage may occur if " Absolute Maximum Ratings" are exceeded. Functional operation should be
restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
The HMD4M32M2VE is a 4M x 32 bit dynamic RAM high-density memory module. The module consists of two CMOS M x 16 bit DRAMs in 50-pin TSOP packages mounted on a 72-pin. A 0.1 or 0.22uF decoupling capacitor is mounted on he printed circuit board for each DRAM components. The module HMD4M32M2VE is a single In-line memory module with edge onnections and is intended for mounting in to 72-pin edge connector sockets. All module components may be owered rom a single 3.3V DC power supply. All inputs and outputs are LVTTL-compatible.