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HMC395

Features: Gain: 15 dBP1dB Output Power: +16 dBmStable Gain Over Temperature50 Ohm I/O'sSmall Size: 0.38 mm x 0.58 mm x 0.1 mmApplicationAn excellent cascadable 50 Ohm Gain Block or LO Driver for:• Microwave & VSAT Radios• Test Equipment• Military EW, ECM, C3I• Space Tel...

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SeekIC No. : 004363989 Detail

HMC395: Features: Gain: 15 dBP1dB Output Power: +16 dBmStable Gain Over Temperature50 Ohm I/O'sSmall Size: 0.38 mm x 0.58 mm x 0.1 mmApplicationAn excellent cascadable 50 Ohm Gain Block or LO Driver for:...

HMC395 Data Sheet

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Part Number:
HMC395
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/12

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Product Details

Description



Features:

Gain: 15 dB
P1dB Output Power: +16 dBm
Stable Gain Over Temperature
50 Ohm I/O's
Small Size: 0.38 mm x 0.58 mm x 0.1 mm




Application

An excellent cascadable 50 Ohm Gain Block or LO Driver for:
• Microwave & VSAT Radios
• Test Equipment
• Military EW, ECM, C3I
• Space Telecom




Specifications

Collector Bias Voltage (Vcc) +7.0 Vdc
RF Input Power (RFin)(Vs = +5.0 Vdc) +10 dBm
Junction Temperature 150 °C
Continuous Pdiss (T = 85 °C)
(derate 16 mW/°C above 85 °C)		 0.475 W
Thermal Resistance
(junction to ground paddle)		 137 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C





Description

The HMC395 die is a GaAs InGaP Heterojunction Bi-polar Transistor (HBT) Gain Block MMIC DC - 4 GHz amplifier. This amplifier die can be used as either a cascadable 50 Ohm gain stage or to drive the LO of HMC mixers with up to +17dBm output power. The HMC395 offers 16 dB of gain and an output IP3 of +31dBm while requiring only 54mA from a +5V supply.

The Darlington feedback pair used results in reduced sensitivity to normal process variations and yields excellent gain stability over temperature while requiring a minimal number of external bias components. The HMC395 can easily be integrated into Multi-Chip-Modules (MCMs) due to its small (0.22mm²) size. All data is with the chip in a 50 Ohm test fixture connected via 0.025mm (1mil) diameter wire bonds of minimal length 0.5mm (20mils).






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