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HMC383

Features: Gain: 16 dBSaturated Output Power: +18 dBmOutput IP3: +25 dBmSingle Positive Supply: +5.0 V @ 101 mA50 Ohm Matched Input/Output2.26 mm x 1.35 mm x 0.1 mmApplicationThe HMC383 is ideal for use as a driver amplifi er for:• Point-to-Point Radios• Point-to-Multi-Point Radios &...

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SeekIC No. : 004363964 Detail

HMC383: Features: Gain: 16 dBSaturated Output Power: +18 dBmOutput IP3: +25 dBmSingle Positive Supply: +5.0 V @ 101 mA50 Ohm Matched Input/Output2.26 mm x 1.35 mm x 0.1 mmApplicationThe HMC383 is ideal for ...

HMC383 Data Sheet

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Part Number:
HMC383
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

Gain: 16 dB
Saturated Output Power: +18 dBm
Output IP3: +25 dBm
Single Positive Supply: +5.0 V @ 101 mA
50 Ohm Matched Input/Output
2.26 mm x 1.35 mm x 0.1 mm


Application

The HMC383 is ideal for use as a driver amplifi er for:
• Point-to-Point Radios
• Point-to-Multi-Point Radios & VSAT
• Test Equipment & Sensors
• LO Driver for HMC Mixers
• Military & Space


Specifications

Drain Bias Voltage (Vdd) +5.5 Vdc
RF Input Power (RFin)(Vdd = +5.0 Vdc) +10 dBm
Junction Temperature 175
Continuous Pdiss (T= 85)
(derate 9.9mW/ above 85)		 0.89 W
Thermal Resistance
(channel to die bottom)		 101.0/W
Storage Temperature -65 to +150
Operating Temperature -40 to to +85
ESD Sensitivity (HBM) Class 1A



Description

The HMC383 is a general purpose GaAs PHEMT MMIC Driver Amplifi er which operates between 12 and 30 GHz. The amplifi er provides 16 dB of gain and +18 dBm of saturated power from a +5.0V supply. Consistent gain and output power across the operating band make it possible to use a common driver/LO amplifi er approach in multiple radio bands.

The HMC383 amplifi er can easily be integrated into Multi-Chip-Modules (MCMs) due to its compact size, single supply operation, and DC blocked RF I/Os. All data is measured with the chip in a 50 Ohm test fi xture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils).




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