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HM62864

Features: ` High speed - Fast access time: 55/70/85 ns (max)` Low power - Active: 50 mW (typ) (f = 1 MHz) - Standby: 2 W (typ)` Single 5 V supply` Completely static memory No clock or timing strobe required` Equal access and cycle times` Common data input and output Three state output` Directly TT...

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SeekIC No. : 004363524 Detail

HM62864: Features: ` High speed - Fast access time: 55/70/85 ns (max)` Low power - Active: 50 mW (typ) (f = 1 MHz) - Standby: 2 W (typ)` Single 5 V supply` Completely static memory No clock or timing strobe ...

HM62864 Data Sheet

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Part Number:
HM62864
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

`  High speed
     - Fast access time: 55/70/85 ns (max)
`  Low power
     - Active: 50 mW (typ) (f = 1 MHz)
     - Standby: 2 W (typ)
`  Single 5 V supply
`  Completely static memory No clock or timing strobe required
`  Equal access and cycle times
`  Common data input and output Three state output
`  Directly TTL compatible All inputs and outputs
`  Capability of battery backup operation 2 chip selection for battery backup


Pinout

Connection Diagram


Specifications

Parameter
Symbol
Value
Unit
Power supply voltage*1
VCC
0.5 to +7.0
V
Terminal voltage *1
VT
0.5 *2 to VCC + 0.3*3
V
Power dissipation
PT
1.0
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C
Storage temperature under bias
Tbias
10 to +85
°C
Notes:
1. Relative to VSS
2. VT min: 3.0 V for pulse half-width  50 ns
3. Maximum voltage is 7.0V


Description

The Hitachi HM62864 is a CMOS static RAM organized 64-kword × 8-bit. HM62864 realizes higher density, higher performance and low power consumption by employing 0.8 mm Hi-CMOS process technology. It offers low power standby power dissipation; therefore, it is suitable for battery backup systems. The device, packaged in a 525-mil SOP (460-mil body SOP) and a 8 ´ 20 mm TSOP with thickness of 1.2 mm, is available for high density mounting. TSOP package is suitable for cards.




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