HIP0045

Features: • Octal NDMOS Output Drivers in a High Voltage Power BiMOS Process• Over-Stress Protection - Each Output: - Over-Current Protection . . . . . . . . . . . . . . . . . . . 1A Min - Over-Voltage Clamp Protection . . . . . . . . . . . . 50V Typ - Thermal Shutdown Protection (2 Ch...

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HIP0045 Picture
SeekIC No. : 004362662 Detail

HIP0045: Features: • Octal NDMOS Output Drivers in a High Voltage Power BiMOS Process• Over-Stress Protection - Each Output: - Over-Current Protection . . . . . . . . . . . . . . . . . . . 1A Min...

floor Price/Ceiling Price

Part Number:
HIP0045
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Description



Features:

• Octal NDMOS Output Drivers in a High Voltage Power BiMOS Process
• Over-Stress Protection - Each Output:
        - Over-Current Protection . . . . . . . . . . . . . . . . . . . 1A Min
        - Over-Voltage Clamp Protection . . . . . . . . . . . . 50V Typ
        - Thermal Shutdown Protection (2 Channels)
• Open-Load Detection
• Power BiMOS Output Configuration
        - Current Latch-Off Protection for 6 Channels; 2 with External Drive Input and ORed with SPI Bus Control
        - 2 Channels Configured for Lamp Drivers with Current Limiting and Over-Temperature Latch-Off
• High Speed CMOS Logic Control
        - SPI Bus Controlled Interface
        - Individual Output Latch
        - Individual Fault Unlatch and Feedback
        - Common Reset Line
• Low Quiescent Current . . . . . . . . . . . . . . . . . . . 5mA Max
• Ambient Operating Temp. Range . . . . . . . -40oC to 125oC



Application

• Automotive and Industrial Systems
• Solenoids, Relays and Lamp Drivers
• Logic and mP Controlled Drivers
• Robotic Controls



Pinout

  Connection Diagram


Specifications

Maximum Output Voltage, VOUT . . . . . . . . . . . . . . . . . . .-0.7 to VOC
Peak Output Load Current, ILOAD . . . .. .  . As Specified for ISC, ILIM
Continuous Output Load Current, IOUT (All 8 Outputs ON) . . . . 0.5A
Continuous Output Load Current, IOUT (Any one Output ON) . . . 1A
Total Average Current, IOUT (All 8 Outputs) . . . . . . . . . . . . . . . 4.5A
Reverse Peak Current Drive, Any one Output, IRD; t 2ms . ..  . -3A
DC Logic Supply, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 7V
Input Voltage, All Inputs and Data Lines . . . . . . . -0.3 to VCC +0.3V



Description

The HIP0045 is a logic controlled, eight channel Octal Serial Power Low Side Driver. The serial peripheral interface (SPI) utilized by the HIP0045 is a serial synchronous bus compatible with Intersil CDP68HC05, or equivalent, microcomputers. As shown in the Block Diagram for the HIP0045, each of the open drain MOS Output Drivers have individual protection for overvoltage and over-current. Each output channel has separate output latch control with fault unlatch and diagnostic or status feedback. Under normal ON conditions, each output driver is in a low voltage, high current state of saturated turn-on.

Comparators in the diagnostic circuitry monitor the output drivers to determine if an out of saturation condition exists. If a fault is sensed, the respective output driver for Channels 0 - 5 have overcurrent latch-off. Channels 6 and 7 are configured for lamp drivers and have current limiting with over-temperature latch-off. Channels 0 and 1 have direct parallel drive control for PWM applications and are ORed with the SPI Bus control. All channels of HIP0045 are SPI Bus controlled and sense the output states for diagnostic feedback.

The HIP0045 is fabricated in a Power BiMOS IC process, and is intended for use in automotive and other applications having a wide range of temperature and electrical stress conditions. It is particularly suited for driving relays, solenoids and lamps in applications where low standby power, high operating voltage, and high output current in high ambient temperature conditions is required.

The HIP0045 is in a 20 lead plastic Power SOP (PSOP) Package with an integral copper 'slug' to conduct heat directly to a PCB interface or heat sink on the bottom of the package.


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