HEATPAD SIP PKG W/ADH HI-FLOW
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Technical/Catalog Information | HF115TAAC-105 |
Vendor | Bergquist |
Category | Fans, Thermal Management |
Usage | SIP |
Shape | Rectangular |
Material | Fiberglass |
Thermal Conductivity | 0.8 W/m-K |
Thermal Resistivity | 0.2°C/W |
Thickness | 0.005" (0.127mm) |
Outline | 36.83mm x 21.08mm |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | HF115TAAC 105 HF115TAAC105 BER170 ND BER170ND BER170 |