THERM PAD TO-3 W/ADH HI-FLOW
HF115AC-0.0055-AC-05: THERM PAD TO-3 W/ADH HI-FLOW
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Series: | Hi-Flow® 115-AC | Manufacturer: | Bergquist | ||
Usage: | TO-3 | Shape: | Rhombus | ||
Outline: | 41.91mm x 28.95mm | Thickness: | 0.0055" (0.140mm) | ||
Propagation Delay Time : | 35 ns | Material: | Phase Change Compound | ||
Adhesive: | Adhesive - One Side | Backing, Carrier: | Fiberglass | ||
Color: | Gray | Thermal Resistivity: | 0.35°C/W |