HF115AC-0.0055-AC-05

THERM PAD TO-3 W/ADH HI-FLOW

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HF115AC-0.0055-AC-05 Picture
SeekIC No. : 003445899 Detail

HF115AC-0.0055-AC-05: THERM PAD TO-3 W/ADH HI-FLOW

floor Price/Ceiling Price

US $ .06~.17 / Piece | Get Latest Price
Part Number:
HF115AC-0.0055-AC-05
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~50
  • 50~100
  • 100~500
  • 500~1000
  • 1000~5000
  • 5000~10000
  • Unit Price
  • $.17
  • $.15
  • $.13
  • $.12
  • $.1
  • $.08
  • $.07
  • $.06
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Upload time: 2024/11/18

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Product Details

Quick Details

Series: Hi-Flow® 115-AC Manufacturer: Bergquist
Usage: TO-3 Shape: Rhombus
Outline: 41.91mm x 28.95mm Thickness: 0.0055" (0.140mm)
Propagation Delay Time : 35 ns Material: Phase Change Compound
Adhesive: Adhesive - One Side Backing, Carrier: Fiberglass
Color: Gray Thermal Resistivity: 0.35°C/W    

Description

Color: Gray
Adhesive: Adhesive - One Side
Material: Phase Change Compound
Backing, Carrier: Fiberglass
Series: Hi-Flow® 115-AC
Manufacturer: Bergquist
Thickness: 0.0055" (0.140mm)
Thermal Resistivity: 0.35°C/W
Thermal Conductivity: 0.8 W/m-K
Shape: Rhombus
Usage: TO-3
Outline: 41.91mm x 28.95mm


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