THERM PAD SIP PKG W/ADH HI-FLOW
HF115AC-0.0055-AC-105: THERM PAD SIP PKG W/ADH HI-FLOW
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Series: | Hi-Flow® 115-AC | Manufacturer: | Bergquist | ||
Usage: | SIP | Shape: | Rectangular | ||
Outline: | 36.83mm x 21.29mm | Thickness: | 0.0055" (0.140mm) | ||
Propagation Delay Time : | 35 ns | Material: | Phase Change Compound | ||
Adhesive: | Adhesive - One Side | Backing, Carrier: | Fiberglass | ||
Color: | Gray | Thermal Resistivity: | 0.35°C/W |