HEATPAD TO-3 W/ADH HI-FLOW
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Technical/Catalog Information | HF115TAAC-05 |
Vendor | Bergquist |
Category | Fans, Thermal Management |
Usage | TO-3 |
Shape | Rhombus |
Material | Fiberglass |
Thermal Conductivity | 0.8 W/m-K |
Thermal Resistivity | 0.2°C/W |
Thickness | 0.005" (0.127mm) |
Outline | 41.91mm x 28.95mm |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | HF115TAAC 05 HF115TAAC05 BER166 ND BER166ND BER166 |