HBFP-0405

Features: • Ideal for High Gain, Low Current Applications• Typical Performance at 1.8 GHz Associated Gain of 18 dB and Noise Figure of 1.2 dB at 2 V and 2 mA P1dB of 5 dBm at 2 V and 5 mA• Miniature 4-lead SC-70 (SOT-343) Plastic Package• Transition Frequency fT = 25 GHzApp...

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HBFP-0405 Picture
SeekIC No. : 004359076 Detail

HBFP-0405: Features: • Ideal for High Gain, Low Current Applications• Typical Performance at 1.8 GHz Associated Gain of 18 dB and Noise Figure of 1.2 dB at 2 V and 2 mA P1dB of 5 dBm at 2 V and 5 m...

floor Price/Ceiling Price

Part Number:
HBFP-0405
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

• Ideal for High Gain, Low Current Applications
• Typical Performance at 1.8 GHz Associated Gain of 18 dB and Noise Figure of 1.2 dB at 2 V and 2 mA P1dB of 5 dBm at 2 V and 5 mA
• Miniature 4-lead SC-70 (SOT-343) Plastic Package
• Transition Frequency fT = 25 GHz



Application

• LNA, Oscillator, Driver Amplifier, Buffer Amplifier, and Down Converter for Cellular and PCS Handsets and Cordless Telephones
• Oscillator for TV Delivery and TVRO Systems up to 12 GHz



Pinout

  Connection Diagram


Specifications

Symbol Parameter Units Absolute
Maximum[1]
VEBO Emitter-Base Voltage V 1.5
VCBO Collector-Base Voltage V 15.0
VCEO Collector-Emitter Voltage V 4.5
IC Collector Current mA 12
PT
Power Dissipation[2] mW 54
Tj Junction Temperature 150
TSTG Storage Temperature -65 to 150



Description

Hewlett Packard's HBFP-0405 is a high performance isolated collector silicon bipolar junction transistor housed in a 4-lead SC-70 (SOT-343) surface mount plastic package.

HBFP-0405 provides an associated gain of 18 dB, noise figure of 1.2 dB, and P1dB of 5 dBm at 1.8 GHz. Because of high gain and low current characteristics, HBFP-0405 is ideal for cellular/ PCS as well as for C-Band and Ku-Band applications. This product is based on a 25 GHz transition frequency fabrication process, which enables the products to be used for high performance, low noise applications at 900 MHz, 1.9 GHz, 2.4 GHz, and beyond.


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