HB56UW873E-F

The HB56UW873E-F is one member of the HB56UW873E series.The HB56UW873E belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications. The HB56UW 873E is a 8M x 72 dynamic RAM module, mounted 9 pieces of 64-Mbit DRAM (HMS 165805) sealed in TSOP package and 2 pieces of 16-bit line driver sealed in TSSOP package.

Features of the HB56UW873E-F are:(1)168-pin socket type package (dual lead out); (2)single 3.3 V supply:3.3±0.3 V; (3)high speed; (4)low power dissipation; (5)buffered input except RAS and DQ; (6)4 byte interleave enabled, dual address input (AO/BO);(7)EDO page mode capability. The HB56UW 873E offers Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB56UW873E is 168-pin sockettype package (dual lead out).Therefore, the HB56UW873E makes high density mounting  possible without surface mount technology.The HB56UW873E provides common data inputs and  outputs.Decoupling capacitors are mounted beside each TSOP on the its module board.

The absolute maximum ratings of the HB56UW873E-F can be summarized as:(1)storage temperature range:-55 to 125;(2)voltage on any pin relative to VSS:-0.5 to 4.6V;(3)supply voltage relative to VSS:-0.5 to 4.6V;(4)short circuit output current:50mA;(5)power dissipation:10W.Design your application so that the product is used within the ranges guaranteed by Elpida Memory, Inc.particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Elpida Memory, Inc. bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Elpida Memory, Inc. product does not cause bodily injury,fire or other consequential damage due to operation of the Elpida Memory, Inc. product.Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.