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HB56UW865EJN

Features: ` 168-pin socket type package (Dual lead out) - Outline: 133.35 mm (Length) * 25.40 mm (Height) * 5.28 mm (Thickness) - Lead pitch : 1.27 mm` Single 3.3 V (±0.3 V)` High speed - Access time: tRAC = 60 ns/70 ns (max) - Access time: tCAC = 15 ns/18 ns (max)` Low power dissipation - Active ...

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SeekIC No. : 004359014 Detail

HB56UW865EJN: Features: ` 168-pin socket type package (Dual lead out) - Outline: 133.35 mm (Length) * 25.40 mm (Height) * 5.28 mm (Thickness) - Lead pitch : 1.27 mm` Single 3.3 V (±0.3 V)` High speed - Access tim...

HB56UW865EJN Data Sheet

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Part Number:
HB56UW865EJN
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

`  168-pin socket type package (Dual lead out)
     - Outline: 133.35 mm (Length) * 25.40 mm (Height) * 5.28 mm (Thickness)
     - Lead pitch : 1.27 mm
`  Single 3.3 V (±0.3 V)
`  High speed
     - Access time: tRAC = 60 ns/70 ns (max)
     - Access time: tCAC = 15 ns/18 ns (max)
`  Low power dissipation
     - Active mode: 5.33 W/4.75W (max)
     - Standby mode (TTL): 57.6 mW (max)
     - Standby mode (CMOS): 28.8 mW (max)
`  JEDEC standard outline unbuffered 8-byte DIMM
`  EDO page mode capability
`  4096 refresh cycles: 64 ms


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to + 4.6
V
Supply voltage relative to VSS
VCC
0.5 to + 4.6
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
8.0
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56UW865EJN Series belongs to 8-byte DIMM (Dual in-line Memory Module) family , and has been developed an optimized main memory solution for 4 and 8-byte processor applications. The  Series is a 8 M×64 Dynamic RAM Module, mounted 8 pieces of 64-Mbit DRAM (HM5165805AJ) sealed in SOJ package and 1 piece of serial EEPROM (24C02) for Presence Detect (PD). The Series offers Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB56UW865EJN Series is 168-pin socket type package (dual lead out). Therefore, the Series makes high density mounting possible without surface mount technology. The  Series provides common data inputs and outputs. Decoupling capacitors are mounted beside each SOJ on the its module board.




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