Features: ` 144-pin Zig Zag Dual tabs socket type - Outline: 67.60 mm (Length) * 25.40 mm (Height) * 3.80 mm (Thickness) - Lead pitch : 0.80 mm` Single 3.3 V (±0.3 V)` High speed - Access time: tRAC = 60 ns/70 ns (max) - Access time: tCAC = 15 ns/18 ns (max)` Low power dissipation - Active mode: 4...
HB56UW865DB: Features: ` 144-pin Zig Zag Dual tabs socket type - Outline: 67.60 mm (Length) * 25.40 mm (Height) * 3.80 mm (Thickness) - Lead pitch : 0.80 mm` Single 3.3 V (±0.3 V)` High speed - Access time: tRAC...
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Features: • 72-pin single in-line package - Lead pitch : 1.27 mm• Single 5 V (± 5%) su...
Parameter |
Symbol |
Value |
Unit |
Voltage on any pin relative to VSS |
VT |
0.5 to + 4.6 |
V |
Supply voltage relative to VSS |
VCC |
0.5 to + 4.6 |
V |
Short circuit output current |
Iout |
50 |
mA |
Power dissipation |
PT |
8.0 |
W |
Operating temperature |
Topr |
0 to +70 |
°C |
Storage temperature |
Tstg |
55 to +125 |
°C |
The HB56UW865DB Series is a 8 M × 64 Dynamic RAM Small Outline Dual In-line Memory Module (S. O. DIMM), mounted 8 pieces of 64-Mbit DRAM (HM5165805ATT/ALTT) sealed in TSOP package and 1 piece of serial EEPROM (24C02) for Presence Detect (PD). The Series offers Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the Series is 144-pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the HB56UW865DB Series makes high density mounting possible without surface mount technology. The Series provides common data inputs and outputs. Decoupling capacitors are mounted beside each TSOP on the its module board.