Features: ` 168-pin socket type package (Dual lead out) - Outline: 133.35 mm (Length) * 25.40 mm (Height) * 5.28 mm (Thickness) - Lead pitch : 1.27 mm` Single 3.3 V (±0.3 V)` High speed - Access time: tRAC = 60 ns/70 ns (max) - Access time: tCAC = 15 ns/18 ns (max)` Low power dissipation - Active ...
HB56UW864EJN: Features: ` 168-pin socket type package (Dual lead out) - Outline: 133.35 mm (Length) * 25.40 mm (Height) * 5.28 mm (Thickness) - Lead pitch : 1.27 mm` Single 3.3 V (±0.3 V)` High speed - Access tim...
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Features: • 72-pin single in-line package - Lead pitch : 1.27 mm• Single 5 V (± 5%) su...
Parameter |
Symbol |
Value |
Unit |
Voltage on any pin relative to VSS |
VT |
0.5 to + 4.6 |
V |
Supply voltage relative to VSS |
VCC |
0.5 to + 4.6 |
V |
Short circuit output current |
Iout |
50 |
mA |
Power dissipation |
PT |
0.8 |
W |
Operating temperature |
Topr |
0 to +70 |
°C |
Storage temperature |
Tstg |
55 to +125 |
°C |
The HB56UW864EJN Series belongs to 8-byte DIMM (Dual in-line Memory Module) family , and has been developed an optimized main memory solution for 4 and 8-byte processor applications. The Series is a 8 M ×64 Dynamic RAM Module, mounted 8 pieces of 64-Mbit DRAM (HM5164805AJ) sealed in SOJ package and 1 piece of serial EEPROM (24C02) for Presence Detect (PD). The Series offers Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB56UW864EJN Series is 168-pin socket type package (dual lead out). Therefore, the Series makes high density mounting possible without surface mount technology. The Series provides common data inputs and outputs. Decoupling capacitors are mounted beside each SOJ on the its module board.