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HB56UW3273

Features: ` 168-pin socket type package (Dual lead out) - Outline : 133.35 mm (Length) * 60.96 mm (Height) * 4.00 mm (Thickness) (HB56UW3273E Series) Outline : 176.53 (133.35) mm (Length) ´ 41.91 mm (Height) ´ 9.00 mm (Thickness) (HB56UW3273EJ Series) - Lead pitch : 1.27 mm` Single 3....

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SeekIC No. : 004359000 Detail

HB56UW3273: Features: ` 168-pin socket type package (Dual lead out) - Outline : 133.35 mm (Length) * 60.96 mm (Height) * 4.00 mm (Thickness) (HB56UW3273E Series) Outline : 176.53 (133.35) mm (Length) ´ 4...

HB56UW3273 Data Sheet

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Part Number:
HB56UW3273
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

`  168-pin socket type package (Dual lead out)
     - Outline : 133.35 mm (Length) * 60.96 mm (Height) * 4.00 mm (Thickness)
     (HB56UW3273E Series)
     Outline : 176.53 (133.35) mm (Length) ´ 41.91 mm (Height) ´ 9.00 mm (Thickness)
     (HB56UW3273EJ Series)
     - Lead pitch : 1.27 mm
`  Single 3.3 V supply (±0.3 V)
`  High speed
     - Access time: tRAC = 60 ns/70 ns (max)
     - Access time: tCAC = 20 ns/23 ns (max)
`  Low power dissipation
     - Active mode: 12.02 W/10.73 W (max)
     - Standby mode (TTL): 295.2 mW (max)
`  JEDEC standard outline buffered 8-byte DIMM
`  Buffered input except RAS and DQ
`  4-byte interleave enabled, dual address input (A0/B0)
`  EDO page mode capability
`  4096 refresh cycles: 64 ms
`  2 variations of refresh
     - RAS -only refresh
     - CAS -before- RAS refresh
`  TTL compatible


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to + 4.6
V
Supply voltage relative to VSS
VCC
0.5 to + 4.6
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
19
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56UW3273 Series belongs to 8-byte DIMM (Dual in-line Memory Module) family , and has been developed an optimized main memory solution for 4 and 8-byte processor applications. The  Series is a 32 M *72 Dynamic RAM Module, mounted 36 pieces of 64-Mbit DRAM (HM5165405ATT) sealed in TSOP package and 2 pieces of 16-bit BiCMOS line driver (74LVT16244) sealed in TSSOP package. The HB56UW3273EJ Series is a 32 M *72 Dynamic RAM Module, mounted 36 pieces of 64-Mbit DRAM (HM5165405AJ) sealed in SOJ package and 2 pieces of 16-bit BiCMOS line driver (74LVT16244) sealed in TSSOP package. The HB56UW3273 Series offers Extended Data Out (EDO) Page Mode as a high ÅiìÅiìspeed access mode. An outline of the HB56UW3273 Series is 168-pin socket type package (dual lead out). Therefore, the  Series makes high density mounting possible without surface mount technology. The  Series provides common data inputs and outputs. Decoupling capacitors are mounted beside each TSOP or SOJ on the its module board.




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