HB56UW3272

Features: ` 168-pin socket type package (Dual lead out) - Outline : 133.35 mm (Length) * 60.96 mm (Height) * 4.00 mm (Thickness) (HB56UW3272E Series) Outline : 176.53 (133.35) mm (Length) ´ 41.91 mm (Height) ´ 9.00 mm (Thickness) (HB56UW3272EJ Series) - Lead pitch : 1.27 mm` Single 3.3...

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HB56UW3272 Picture
SeekIC No. : 004358998 Detail

HB56UW3272: Features: ` 168-pin socket type package (Dual lead out) - Outline : 133.35 mm (Length) * 60.96 mm (Height) * 4.00 mm (Thickness) (HB56UW3272E Series) Outline : 176.53 (133.35) mm (Length) ´ 41...

floor Price/Ceiling Price

Part Number:
HB56UW3272
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

`  168-pin socket type package (Dual lead out)
     - Outline : 133.35 mm (Length) * 60.96 mm (Height) * 4.00 mm (Thickness)
      (HB56UW3272E Series)
     Outline : 176.53 (133.35) mm (Length) ´ 41.91 mm (Height) ´ 9.00 mm (Thickness)
     (HB56UW3272EJ Series)
     - Lead pitch : 1.27 mm
`  Single 3.3 V supply (±0.3 V)
`  High speed
     - Access time: tRAC = 60 ns/70 ns (max)
     - Access time: tCAC = 20 ns/23 ns (max)
`  Low power dissipation
     - Active mode: 8.78 W/7.49W (max)
     - Standby mode (TTL): 295.2 mW (max)
`  JEDEC standard outline buffered 8-byte DIMM
`  Buffered input except RAS and DQ
`  4-byte interleave enabled, dual address input (A0/B0)
`  EDO page mode capability
`  8192 refresh cycles: 64 ms
`  2 variations of refresh
     - RAS -only refresh
     - CAS -before- RAS refresh
`  TTL compatible



Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to + 4.6
V
Supply voltage relative to VSS
VCC
0.5 to + 4.6
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
19
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56UW3272 Series belongs to 8-byte DIMM (Dual in-line Memory Module) family , and has been eveloped an optimized main memory solution for 4 and 8-byte processor applications. The B56UW3272E Series is a 32 M × 72 Dynamic RAM Module, mounted 36 pieces of 64-Mbit DRAM HM5164405ATT) sealed in TSOP package and 2 pieces of 16-bit BiCMOS line driver (74LVT16244) ealed in TSSOP package. The HB56UW3272EJ Series is a 32 M × 72 Dynamic RAM Module, mounted 6 pieces of 64-Mbit DRAM (HM5164405AJ) sealed in SOJ package and 2 pieces of 16-bit BiCMOS line river (74LVT16244) sealed in TSSOP package. The HB56UW3272 Series offers Extended Data Out EDO) Page Mode as a high speed access mode. An outline of the HB56UW3272 Series is 168-pin socket ype package (dual lead out). Therefore, theSeries makes high density mounting possible ithout surface mount technology. The  Series provides common data inputs and outputs. ecoupling capacitors are mounted beside each TSOP or SOJ on the its module board.




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