Features: ` 168-pin socket type package (Dual lead out) - Outline : 133.35 mm (Length) * 60.96 mm (Height) * 4.00 mm (Thickness) (HB56UW3272E Series) Outline : 176.53 (133.35) mm (Length) ´ 41.91 mm (Height) ´ 9.00 mm (Thickness) (HB56UW3272EJ Series) - Lead pitch : 1.27 mm` Single 3.3...
HB56UW3272: Features: ` 168-pin socket type package (Dual lead out) - Outline : 133.35 mm (Length) * 60.96 mm (Height) * 4.00 mm (Thickness) (HB56UW3272E Series) Outline : 176.53 (133.35) mm (Length) ´ 41...
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Features: • 72-pin single in-line package - Lead pitch : 1.27 mm• Single 5 V (± 5%) su...
Parameter |
Symbol |
Value |
Unit |
Voltage on any pin relative to VSS |
VT |
0.5 to + 4.6 |
V |
Supply voltage relative to VSS |
VCC |
0.5 to + 4.6 |
V |
Short circuit output current |
Iout |
50 |
mA |
Power dissipation |
PT |
19 |
W |
Operating temperature |
Topr |
0 to +70 |
°C |
Storage temperature |
Tstg |
55 to +125 |
°C |
The HB56UW3272 Series belongs to 8-byte DIMM (Dual in-line Memory Module) family , and has been eveloped an optimized main memory solution for 4 and 8-byte processor applications. The B56UW3272E Series is a 32 M × 72 Dynamic RAM Module, mounted 36 pieces of 64-Mbit DRAM HM5164405ATT) sealed in TSOP package and 2 pieces of 16-bit BiCMOS line driver (74LVT16244) ealed in TSSOP package. The HB56UW3272EJ Series is a 32 M × 72 Dynamic RAM Module, mounted 6 pieces of 64-Mbit DRAM (HM5164405AJ) sealed in SOJ package and 2 pieces of 16-bit BiCMOS line river (74LVT16244) sealed in TSSOP package. The HB56UW3272 Series offers Extended Data Out EDO) Page Mode as a high speed access mode. An outline of the HB56UW3272 Series is 168-pin socket ype package (dual lead out). Therefore, theSeries makes high density mounting possible ithout surface mount technology. The Series provides common data inputs and outputs. ecoupling capacitors are mounted beside each TSOP or SOJ on the its module board.