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HB56U464EJ

Features: · 168-pin socket type package (Dual lead out) -Outline: 133.35 mm (Length) × 25.40 mm (Height) ×9.00 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 50/60/70 ns (max) tCAC = 18/20/23 ns (max)· Low power dissipation -Active mode: 7.90/7.06/6.2...

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SeekIC No. : 004358981 Detail

HB56U464EJ: Features: · 168-pin socket type package (Dual lead out) -Outline: 133.35 mm (Length) × 25.40 mm (Height) ×9.00 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: ...

HB56U464EJ Data Sheet

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Part Number:
HB56U464EJ
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

·  168-pin socket type package (Dual lead out)
     - Outline: 133.35 mm (Length) × 25.40 mm (Height) ×9.00 mm (Thickness)
     - Lead pitch: 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
     - Access time: tRAC = 50/60/70 ns (max)
     tCAC = 18/20/23 ns (max)
·  Low power dissipation
     - Active mode: 7.90/7.06/6.22 W (max)
     - Standby mode (TTL): 504 mW (max)
     (CMOS): 420 mW (max)
·  Buffered input except RAS and DQ
·  4 byte interleave enabled, dual address input (A0/B0)
·  JEDEC standard outline buffered 8-byte DIMM
·  EDO page mode capability
·  4,096 refresh cycles: 64 ms
·  2 variations of refresh
     - RAS -only refresh
     - CAS -before-RAS refresh
·  TTL compatible


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to + 7.0
V
Supply voltage relative to VSS
VCC
0.5 to + 7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
17
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56U464EJ belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications. It is a 4M × 64 dynamic RAM module, mounted 16 pieces of 16-Mbit DRAM (HM5116405) sealed in SOJ package, 1 piece of 16-bit BiCMOS line driver (74ABT16244) sealed in TSSOP package and 1 piece of 20-bit BiCMOS line driver (74ABT16827) sealed in TSSOP package. It offers Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB56U464EJ is 168-pin socket type package (dual lead out). Therefore, the HB56U464EJ makes high density mounting possible without surface mount technology. It provides common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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