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HB56TW432D

Features: · 72-pin Zig Zag Dual tabs socket type -Outline: 59.69 mm (Length)×25.40 mm (Height) × 3.80 mm (Thickness) -Lead pitch: 1.27 mm· Single 3.3 V (±0.3 V) supply· High speed -Access time: tRAC = 50/60/70 ns (max) tCAC = 13/15/18 ns (max)· Low power dissipation -Active mode: 2.59/2.30/2.02 W ...

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SeekIC No. : 004358972 Detail

HB56TW432D: Features: · 72-pin Zig Zag Dual tabs socket type -Outline: 59.69 mm (Length)×25.40 mm (Height) × 3.80 mm (Thickness) -Lead pitch: 1.27 mm· Single 3.3 V (±0.3 V) supply· High speed -Access time: tRAC...

HB56TW432D Data Sheet

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Part Number:
HB56TW432D
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

·  72-pin Zig Zag Dual tabs socket type
     - Outline: 59.69 mm (Length)×25.40 mm (Height) × 3.80 mm (Thickness)
     - Lead pitch: 1.27 mm
·  Single 3.3 V (±0.3 V) supply
·  High speed
     - Access time: tRAC = 50/60/70 ns (max)
     tCAC = 13/15/18 ns (max)
·  Low power dissipation
     - Active mode: 2.59/2.30/2.02 W (max) (HB56TW432D Series)
     2.88/2.59/2.30 W (max) (HB56TW433D Series)
     - Standby mode (TTL): 57.6 mW (max)
     (CMOS): 2.88 mW (max) (L-version)
·  Fast page mode capability
·  Refresh period
     - 4096 refresh cycles: 64 ms (HB56TW432D Series)
     128 ms (L-version)
     - 2048 refresh cycles: 32 ms (HB56TW433D Series)
     128 ms (L-version)
·  4 variations of refresh
     - RAS -only refresh
     - CAS -before-RAS refresh
     - Hidden refresh
     - Self refresh (L-version)


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to + 4.6
V
Supply voltage relative to VSS
VCC
0.5 to + 4.6
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
8
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56TW432D is a 4M ×32 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 8 pieces of 16-Mbit DRAM (HM51W16400) sealed in TSOP package. The HB56TW433D is a 4M ×32 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 8 pieces of 16-Mbit DRAM (HM51W17400) sealed in TSOP package. An outline of the HB56TW432D, HB56TW433D is 72-pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the HB56TW432D, HB56TW433D make high density mounting possible without surface mount technology. They provide common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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