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HB56T433D

Features: · 72-pin Zig Zag Dual tabs socket type -Outline: 59.69 mm (Length) × 25.40 mm (Height) × 3.80 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 50/60/70 ns (max) tCAC = 13/15/18 ns (max)· Low power dissipation -Active mode: 3.78/3.36/2.94 W (ma...

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SeekIC No. : 004358970 Detail

HB56T433D: Features: · 72-pin Zig Zag Dual tabs socket type -Outline: 59.69 mm (Length) × 25.40 mm (Height) × 3.80 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = ...

HB56T433D Data Sheet

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Part Number:
HB56T433D
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·  72-pin Zig Zag Dual tabs socket type
     - Outline: 59.69 mm (Length) × 25.40 mm (Height) × 3.80 mm (Thickness)
     - Lead pitch: 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
     - Access time: tRAC = 50/60/70 ns (max)
     tCAC = 13/15/18 ns (max)
·  Low power dissipation
     - Active mode: 3.78/3.36/2.94 W (max) (HB56T432D Series)
     4.20/3.78/3.36 W (max) (HB56T433D Series)
     - Standb y mode (TTL): 84 mW (max)
     (CMOS): 6.3 mW (max) (L-version)
·  Fast page mode capability


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
1.0 to + 7.0
V
Supply voltage relative to VSS
VCC
1.0 to + 7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
8
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56T432D is a 4M × 32 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 8 pieces of 16-Mbit DRAM (HM5116400) sealed in TSOP package. The HB56T433D is a 4M× 32 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 8 pieces of 16-Mbit DRAM (HM5117400) sealed in TSOP package. An outline of the HB56T432D, HB56T433D is 72-pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the HB56T432D, HB56T433D make high density mounting possible without surface mount technology. They provide common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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