Features: ` 144-pin Zig Zag Dual tabs socket type -Lead pitch: 0.80 mm` Single 3.3 V (+0.3, 0.15 V) supply` High speed -Access time: tRAC = 60 ns (max) tCAC = 15 ns (max)` Low power dissipation -Active mode: 3.024 W (max) -Standby mode (TTL): 115 mW (max) (CMOS): 58 mW (max) (CMOS): 8.64 mW (max) ...
HB56SW464DBJ: Features: ` 144-pin Zig Zag Dual tabs socket type -Lead pitch: 0.80 mm` Single 3.3 V (+0.3, 0.15 V) supply` High speed -Access time: tRAC = 60 ns (max) tCAC = 15 ns (max)` Low power dissipation -Act...
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Features: • 72-pin single in-line package - Lead pitch : 1.27 mm• Single 5 V (± 5%) su...
Parameter |
Symbol |
Value |
Unit |
Voltage on any pin relative to VSS |
VT |
0.5 to +4.6 |
V |
Supply voltage relative to VSS |
VCC |
-0.5 to +4.6 |
V |
Short circuit output current |
Iout |
50 |
mA |
Power dissipation |
PT |
16 |
W |
Operating temperature |
Topr |
0 to +70 |
°C |
Storage temperature |
Tstg |
55 to +125 |
°C |
The HB56SW464DBJ is a 4M×64 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 16 pieces of 16-Mbit DRAM (HM51W17805) sealed in TCP package and 1 piece of serial EEPROM (24C02) for Presence Detect (PD). The HB56SW464DBJ offers Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB56SW464DBJ is 144-pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the B56SW464DBJ makes high density mounting possible without surface mount technology. It provides common data inputs and outputs. Decoupling capacitors are mounted beside each TCP on the module board.