HB56SW3272ESK-6

Features: ` 168-pin socket type package (Dual lead out)- Lead pitch : 1.27 mm` Single 3.3 V supply (±0.3 V)` High speed- Access time: tRAC = 50 ns/60 ns (max)- Access time: tCAC = 18 ns/20 ns (max)` Low power dissipation- Active mode: 8.78 W/7.49 W (max)- Standby mode (TTL): 295.2 mW (max)` J...

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HB56SW3272ESK-6 Picture
SeekIC No. : 004358957 Detail

HB56SW3272ESK-6: Features: ` 168-pin socket type package (Dual lead out)- Lead pitch : 1.27 mm` Single 3.3 V supply (±0.3 V)` High speed- Access time: tRAC = 50 ns/60 ns (max)- Access time: tCAC = 18 ns/20 ns (ma...

floor Price/Ceiling Price

Part Number:
HB56SW3272ESK-6
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

`  168-pin socket type package (Dual lead out)
 - Lead pitch : 1.27 mm
`  Single 3.3 V supply (±0.3 V)
`  High speed
 - Access time: tRAC = 50 ns/60 ns (max)
 - Access time: tCAC = 18 ns/20 ns (max)
`  Low power dissipation
 - Active mode: 8.78 W/7.49 W (max)
 - Standby mode (TTL): 295.2 mW (max)
`  JEDEC standard outline buffered 8-byte DIMM
`  Buffered input except RAS and DQ
`  4-byte interleave enabled, dual address input (A0/B0)
`  EDO page mode capability
`  4096 refresh cycles: 64 ms
`  2 variations of refresh
 - RAS-only refresh
 - CAS-before-RAS refresh



Specifications

Parameter
Symbol
Value
Unit
Note
Voltage on any pin relative to VSS
VT
0.5 to +4.6
V
1
Supply voltage relative to VSS
VCC
0.5 to +4.6
V
1
Short circuit output current
Iout
50
mA
Power dissipation
PT
19
W
Storage temperature
Tstg
50 to +125
°C



Description

The HB56SW3272ESK belong to 8-byte DIMM (Dual in-line Memory Module) family , and have been developed an optimized main memory solution for 4 and 8-byte processor applications. The HB56SW3272ESK is 32 M × 72 Dynamic RAM Module, mounted 36 pieces of 64-Mbit DRAM (HM5165405) sealed in TCP package and 2 pieces of 16-bit BiCMOS line driver sealed in TSSOP package. The HB56SW3272ESK offer Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB56SW3272ESK are 168-pin socket type package (dual lead out). Therefore, it make high density mounting possible without surface mount technology. It provide common data inputs and outputs. Decoupling capacitors are mounted beside each TCP on its module board.

Note of  HB56SW3272ESK : Do not push the cover or drop the modules in order to protect from mechanical defects, which would be electrical defects.




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