Features: · 168-pin socket type package (Dual lead out) -Lead pitch: 1.27 mm· Single 5.0 V (±5%) supply· JEDEC standard outline unbufferd 8 byte DIMM· High speed -Access time: tRAC = 60/70 ns (max) tCAC = 15/18 ns (max)· Low power dissipation -Active mode: 8.03/7.09 W (max) (HB56S872ESN) 7.14/6.30...
HB56S872ESN: Features: · 168-pin socket type package (Dual lead out) -Lead pitch: 1.27 mm· Single 5.0 V (±5%) supply· JEDEC standard outline unbufferd 8 byte DIMM· High speed -Access time: tRAC = 60/70 ns (max) ...
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Features: • 72-pin single in-line package - Lead pitch : 1.27 mm• Single 5 V (± 5%) su...
Parameter |
Symbol |
Value |
Unit |
Voltage on any pin relative to VSS |
VT |
0.5 to +7.0 |
V |
Supply voltage relative to VSS |
VCC |
-0.5 to +7.0 |
V |
Short circuit output current |
Iout |
50 |
mA |
Power dissipation (HB56S872ESN) |
PT |
36 |
W |
Power dissipation (HB56S864ESN) |
PT |
32 |
W |
Operating temperature |
Topr |
0 to +70 |
°C |
Storage temperature |
Tstg |
55 to +125 |
°C |
The HB56S872ESN, HB56S864ESN belong to 8 Byte DIMM (Dual In-line Memory Module) family, and have been developed as an optimized main memory solution for 4 and 8 Byte processor applications. The HB56S872ESN is a 8M × 72 dynamic RAM module, mounted 36 pieces of 16-Mbit DRAM (HM5116405) sealed in TCP package and 1 pieces of serial EEPROM (24C02) for Presence Detect (PD). The HB56S864ESN is a 8M × 64 dynamic RAM module, mounted 32 pieces of 16-Mbit DRAM (HM5116405) sealed in TCP package and 1 pieces of serial EEPROM (24C02) for Presence Detect (PD). The HB56S872ESN, HB56S864ESN offer Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB56S872ESN, HB56S864ESN is 168-pin socket type package (dual lead out). Therefore, they make high density mounting possible without surface mount technology. They provide common data inputs and outputs. Decoupling capacitors are mounted beneath each TCP on the module board.