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HB56S864ES-6

Features: · 168-pin socket type package (Dual lead out) -Lead pitch: 1.27 mm· Single 5 V (± 5%) supply· JEDEC standard outline buffered 8 byte DIMM· High speed -Access time: tRAC = 60/70 ns (max) tCAC = 20/23 ns (max)· Low power dissipation -Active mode: 7.48/6.64 W (max) -Standby mode (TTL): 672 ...

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SeekIC No. : 004358951 Detail

HB56S864ES-6: Features: · 168-pin socket type package (Dual lead out) -Lead pitch: 1.27 mm· Single 5 V (± 5%) supply· JEDEC standard outline buffered 8 byte DIMM· High speed -Access time: tRAC = 60/70 ns (max) tC...

HB56S864ES-6 Data Sheet

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Part Number:
HB56S864ES-6
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

·  168-pin socket type package (Dual lead out)
     - Lead pitch: 1.27 mm
·  Single 5 V (± 5%) supply
·  JEDEC standard outline buffered 8 byte DIMM
·  High speed
     -Access time: tRAC = 60/70 ns (max)
     tCAC = 20/23 ns (max)
·  Low power dissipation
     - Active mode: 7.48/6.64 W (max)
     - Standby mode (TTL): 672 mW (max)
     (CMOS): 504 mW (max)
·  Buffered input except RAS and DQ
·  4 byte interleave enabled, duel address input (A0/B0)
·  EDO page mode capability
·  4,096 refresh cycle: 64 ms
·  2 variations of refresh
     - RAS -only refresh
     - CAS -b efore- RAS refresh
·  TTL compatible


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to +7.0
V
Supply voltage relative to VSS
VCC
-0.5 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
33
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56S864ES belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications. The HB56S864ES is a 8M × 64 dynamic RAM module, mounted 32 pieces of 16-Mbit DRAM (HM5116405) sealed in TCP package, 1 piece of 16-bit BiCMOS line driver (74ABT16244) sealed in TSSOP package and 1 piece of 20-bit CMOS line driver (74ABT16827) sealed in TSSOP package. It offers Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the product is 168-pin socket type package (dual lead out). Therefore, the HB56S864ES makes high density mounting possible without surface mount technology. It provides common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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