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HB56R872ES

Features: · 168-pin socket type package (Dual read out) - Lead pitch : 1.27 mm· Single 5 V (±5%) supply· High speed - Access time : tRAC = 60 / 70 /80 ns (max.) - Access time : tCAC = 20 / 23 /25 (max.)· Low power dissipation - Active mode: 8.37 / 7.42 / 6.95 W (max.) - Standby mode: 714 mW (max.)...

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SeekIC No. : 004358946 Detail

HB56R872ES: Features: · 168-pin socket type package (Dual read out) - Lead pitch : 1.27 mm· Single 5 V (±5%) supply· High speed - Access time : tRAC = 60 / 70 /80 ns (max.) - Access time : tCAC = 20 / 23 /25 (m...

HB56R872ES Data Sheet

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Part Number:
HB56R872ES
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·  168-pin socket type package (Dual read out)
     -  Lead pitch : 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
     -  Access time : tRAC = 60 / 70 /80 ns (max.)
     -  Access time : tCAC = 20 / 23 /25 (max.)
·  Low power dissipation
     -  Active mode: 8.37 / 7.42 / 6.95 W (max.)
     -  Standby mode: 714 mW (max.)
·  Buffered input except /RAS and DQ
·  4 byte interleave enabled, dual address input (A0/B0)
·  Fast page mode capability
·  4,096 refresh cycle/64 ms
·  2 variations of refresh
     -  /RAS - only refresh
     -  /CAS - before - /RAS refresh
·  TTL compatible


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to Vss.
For 10ns or less
VT
-0.5 to +7.0
-1.5
V
Supply voltage relative to Vss
Vcc
-0.5 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
Pt
37
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
-55 to +125
°C



Description

The HB56R872ES belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has beendeveloped as an optimized main memory solution for 4 and 8 Byte processor applications.

The HB56R872ES is a 8M x 72 dynamic RAM module, mounted 36 pieces of 16-Mbit DRAM (HM5116400) sealed in TCP package and 2 pieces of 16-bit BiCMOS line driver (74ABT16244DGG) sealed in TSSOP package.

An outline of the HB56R872ES is 168-pin socket type package (dual read out). Therefore, the HB56R872ES makes high density mounting possible without surface mount technology.

The HB56R872ES provides common data inputs and outputs. Decoupling capacitors are mounted beside each TSOP on the its module board.




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