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HB56HW465DB

Features: · 144-pin Zig Zag Dual tabs socket type -Outline: 67.60 mm (Length)× 25.40 mm (Height) × 3.80 mm (Thickness) -Lead pitch : 0.80 mm· Single 3.3 V (±0.3 V)· High speed -Access time: tRAC = 60 ns/70 ns (max) -Access time: tCAC = 15 ns/18 ns (max)· Low power dissipation -Active mode: 2.60 W/...

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SeekIC No. : 004358944 Detail

HB56HW465DB: Features: · 144-pin Zig Zag Dual tabs socket type -Outline: 67.60 mm (Length)× 25.40 mm (Height) × 3.80 mm (Thickness) -Lead pitch : 0.80 mm· Single 3.3 V (±0.3 V)· High speed -Access time: tRAC = 6...

HB56HW465DB Data Sheet

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Part Number:
HB56HW465DB
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

·  144-pin Zig Zag Dual tabs socket type
     - Outline: 67.60 mm (Length)× 25.40 mm (Height) × 3.80 mm (Thickness)
     - Lead pitch : 0.80 mm
·  Single 3.3 V (±0.3 V)
·  High speed
     - Access time: tRAC = 60 ns/70 ns (max)
     - Access time: tCAC = 15 ns/18 ns (max)
·  Low power dissipation
     - Active mode: 2.60 W/2.24 W (max)
     - Standby mode (TTL): 28.8 mW (max)
     - Standby mode (CMOS): 14.4 mW (max)
     2.9 mW (max) (L-version)
·  JEDEC standard outline S. O. DIMM
·  EDO page mode capability
·  4096 refresh cycles: 64 ms
     : 128 ms (L-version)


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to +7.0
V
Supply voltage relative to VSS
VCC
0.5 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
4.0
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The Series is a 4 M× 64 Dynamic RAM Small Outline Dual In-line Memory Module (S. O. DIMM), mounted 4 pieces of 64-Mbit DRAM  M5165165ATT/ALTT) sealed in TSOP package and 1 piece of serial EEPROM (24C02) for Presence Detect (PD). The HB56HW465DB Series offers Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB56HW465DB Series is 144- pin Zig Zag Dual tabs socket type compact and thin package. Therefore, theSeries makes high density mounting possible without surface mount technology. The Series provides common data inputs and outputs. Decoupling capacitors are mounted beside each TSOP on the module board.




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