Features: · 144-pin Zig Zag Dual tabs socket type-Outline: 67.60 mm (Length) × 25.40 mm (Height) × 3.80 mm (Thickness)-Lead pitch: 0.80 mm· Single 3.3 V (±0.3 V) supply· High speed-Access time: tRAC = 60/70 ns (max) tCAC = 15/18 ns (max)· Low power dissipation-Active mode: 1.44/1.30 W (max) (HB56H...
HB56HW165DB: Features: · 144-pin Zig Zag Dual tabs socket type-Outline: 67.60 mm (Length) × 25.40 mm (Height) × 3.80 mm (Thickness)-Lead pitch: 0.80 mm· Single 3.3 V (±0.3 V) supply· High speed-Access time: tRAC...
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Features: • 72-pin single in-line package - Lead pitch : 1.27 mm• Single 5 V (± 5%) su...
Parameter | Symbol | Value | Unit |
Voltage on any pin relative to VSS | VT | 0.5 to +4.6 | V |
Supply voltage relative to VSS | VDD | 0.5 to +4.6 | V |
Short circuit output current | Iout | 50 | mA |
Power dissipation | Pt | 4 | W |
Operating temperature | Topr | 0 to +70 | |
Storage temperature | Tstg | 55 to +125 |
The HB56HW164DB is a 1M × 64 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 4 pieces of 16-Mbit DRAM (HM51W16165) sealed in TSOP package and 1 pieces of serial EEPROM (24C02) for Presence Detect (PD). The product is a 1M × 64 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 4 pieces of 16-Mbit DRAM (HM51W18165) sealed in TSOP package and 1 pieces of serial EEPROM (24C02) for Presence Detect (PD). They offer Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB56HW164DB, HB56HW165DB is 144-pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the HB56HW164DB, HB56HW165DB make high density mounting possible without surface mount technology. They provide common data inputs and outputs. Decoupling capacitors are mounted on the module board.