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HB56HW164EJN

Features: · 168-pin socket type package (Dual lead out) -Outline: 133.35 mm (Length) ×25.40 mm (Height) ×5.28 mm (Thickness) -Lead pitch: 1.27 mm· Single 3.3 V (±0.3 V) supply· High speed -Access time: tRAC = 60/70ns (max) tCAC = 15/18ns (max)· Low power dissipation -Active mode: 2.45/2.16W (max) ...

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SeekIC No. : 004358942 Detail

HB56HW164EJN: Features: · 168-pin socket type package (Dual lead out) -Outline: 133.35 mm (Length) ×25.40 mm (Height) ×5.28 mm (Thickness) -Lead pitch: 1.27 mm· Single 3.3 V (±0.3 V) supply· High speed -Access ti...

HB56HW164EJN Data Sheet

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Part Number:
HB56HW164EJN
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/31

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Product Details

Description



Features:

·  168-pin socket type package (Dual lead out)
      - Outline: 133.35 mm (Length) ×25.40 mm (Height) ×5.28 mm (Thickness)
      -Lead pitch: 1.27 mm
·  Single 3.3 V (±0.3 V) supply
·  High speed
     - Access time: tRAC = 60/70ns (max)
     tCAC = 15/18ns (max)
·  Low power dissipation
     - Active mode: 2.45/2.16W (max)
     - Standby mode (TTL): 28.8 mW (max)
     (CMOS): 2.16 mW (max) (L-version)
·  JEDEC standard outline unbuffered 8-byte DIMM
·  EDO page mode capability
·  Refresh period
     - 1024 refresh cycles: 16 ms
     128 ms (L-version)


Specifications

Parameter
Symbol
Min
Typ
Max
Unit
Note
Supply voltage
VSS
0
0
0
V
VCC
3.0
3.3
3.6
V
1
Input high voltage
VIH
2.0
-
VCC +0.3
V
1
Input low voltage
VIL
0.3
-
0.8
V
1
Note: 1. All voltage referred to VSS.


Description

The HB56HW164EJN belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications. It is a 1M × 64 dynamic RAM module, mounted 4 pieces of 16-Mbit DRAM (HM51W18165) sealed in SOJ package and 1 pieces of serial EEPROM (24C02) for Presence Detect (PD). The product offers Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB56HW164EJN is 168-pin socket type package (dual lead out). Therefore, it makes high density mounting possible without surface mount technology. It provides common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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