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HB56H132

Features: · 72-pin single in-line package-Outline: 107.95 mm (Length) × 25.40 mm (Height) × 9.14/5.28 mm (Thickness)-Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed-Access time: tRAC = 50 /60 /70ns (max)· Low power dissipation-Active mode: 2.15 /1.84 /1.63 W (max) (HB56H232 Series) 2.10 /...

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SeekIC No. : 004358936 Detail

HB56H132: Features: · 72-pin single in-line package-Outline: 107.95 mm (Length) × 25.40 mm (Height) × 9.14/5.28 mm (Thickness)-Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed-Access time: tRAC = 50 /...

HB56H132 Data Sheet

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Part Number:
HB56H132
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·  72-pin single in-line package
- Outline: 107.95 mm (Length) × 25.40 mm (Height) × 9.14/5.28 mm (Thickness)
- Lead pitch: 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
- Access time: tRAC = 50 /60 /70ns (max)
·  Low power dissipation
- Active mode: 2.15 /1.84 /1.63 W (max) (HB56H232 Series) 2.10 /1.79 /1.58 W (max) (HB56H132 Series)
- Standby mode (TTL): 42 mW (max) (HB56H232 Series) (TTL): 21 mW (max) (HB56H132 Series) (CMOS): 3.15 mW (max) (L-version) (HB56H232 Series) (CMOS): 1.58 mW (max) (L-version) (HB56H132 Series)
·  EDO page mode capability
·  Refresh period
- 1024 refresh cycles: 16 ms 128 ms (L-version)


Pinout

Parameter Symbol Value Unit
Voltage on any pin relative to VSS VT 1.0 to +7.0 V
Supply voltage relative to VSS VCC 1.0 to +7.0 V
Short circuit output current Iout 50 mA
Power dissipation PT 2 W
Operating temperature Topr 0 to +70
Storage temperature Tstg 55 to +125




Description

The HB56H232 is a 2M ×32 dynamic RAM module, mounted 4 pieces of 16-Mbit DRAM (HM5118165) sealed in SOJ package. The HB56H132 is a 1M × 32 dynamic RAM module, mounted 2 pieces of 16-Mbit DRAM (HM5118165) sealed in SOJ package. The HB56H232, HB56H132 offer Extended Data Out (EDO) Page Mode as a high speed access time. An outline of the HB56H232, HB56H132 is 72-pin single in-line package. Therefore, they make high density mounting possible without surface mount technology. They provide common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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