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HB56E436

Features: · 72-pin single in-line package -Outline: 107.95 mm (Length)× 31.75/25.4 mm (Height) × 9.14 mm (Thickness) -Lead pitch : 1.27 mm· Single 5 V (±5%)· High speed -Access time: 60 ns/70 ns (max)· Low power dissipation -Active mode: 7.25 W/6.62 W (max) (HB56E836 Series) -Active mode: 6.93 W/6...

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SeekIC No. : 004358929 Detail

HB56E436: Features: · 72-pin single in-line package -Outline: 107.95 mm (Length)× 31.75/25.4 mm (Height) × 9.14 mm (Thickness) -Lead pitch : 1.27 mm· Single 5 V (±5%)· High speed -Access time: 60 ns/70 ns (ma...

HB56E436 Data Sheet

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Part Number:
HB56E436
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·  72-pin single in-line package
     - Outline: 107.95 mm (Length)× 31.75/25.4 mm (Height) × 9.14 mm (Thickness)
    - Lead  pitch : 1.27 mm
·  Single 5 V (±5%)
·  High speed
     - Access time: 60 ns/70 ns (max)
·  Low power dissipation
     - Active mode: 7.25 W/6.62 W (max) (HB56E836 Series)
     - Active mode: 6.93 W/6.30 W (max) (HB56E436 Series)
     - Standby mode: 252 mW (max) (HB56E836 Series)
     - Standby mode: 126 mW (max) (HB56E436 Series)
·  EDO page mode capability


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
1.0 to +7.0
V
Supply voltage relative to VSS
VCC
1.0 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
12
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56E836 Series is a 8 M ×36 Dynamic RAM Module, mounted 16 pieces of 16-Mbit DRAM (HM5117405) sealed in SOJ package and 8 piece of of 4-Mbit DRAM (HM514105) sealed in SOJ package. The HB56E436 Series is a 4 M× 36 Dynamic RAM Module, mounted 8 pieces of 16-Mbit DRAM (HM5117405) sealed in SOJ package and 4 piece of of 4-Mbit DRAM (HM514105) sealed in SOJ package. The HB56E836 Series, HB56E436 Series offer Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the Series are 72-pin single in-line package. Therefore, the HB56E836 Series, HB56E436 Series make high density mounting possible without surface mount technology. The Series provide common data inputs and outputs. Decoupling capacitors are mounted beneath each SOJ on the module board.




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