Features: · 72-pin single in-line package -Outline: 107.95 mm (Length) × 31.75/25.40 mm (Height)× 9.14 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 60/70ns (max)· Low power dissipation -Active mode: 6.41/5.78 W (max) (HB56D836BR/SBR Series) 6.09/5.4...
HB56D836BR: Features: · 72-pin single in-line package -Outline: 107.95 mm (Length) × 31.75/25.40 mm (Height)× 9.14 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 6...
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Features: • 72-pin single in-line package - Lead pitch : 1.27 mm• Single 5 V (± 5%) su...
Parameter |
Symbol |
Value |
Unit |
Voltage on any pin relative to VSS |
VT |
1.0 to +7.0 |
V |
Supply voltage relative to VSS |
VCC |
1.0 to +7.0 |
V |
Short circuit output current |
Iout |
50 |
mA |
Power dissipation |
PT |
12 |
W |
Operating temperature |
Topr |
0 to +70 |
°C |
Storage temperature |
Tstg |
55 to +125 |
°C |
The HB56D836BR/SBR is a 8M × 36 dynamic RAM module, mounted 16 pieces of 16-Mbit DRAM (HM5117400) sealed in SOJ package and 8 pieces of 4-Mbit DRAM (HM514100) sealed in SOJ package. The HB56D436BR/SBR is a 4M × 36 dynamic RAM module, mounted 8 pieces of 16-Mbit DRAM (HM5117400) sealed in SOJ package and 4 pieces of 4-Mbit DRAM (HM514100) sealed in SOJ package. An outline of the products is 72-pin single in-line package. Therefore, the HB56D836BR/SBR, HB56D436BR/SBR make high density mounting possible without surface mount technology. The HB56D836BR/SBR, HB56D436BR/SBR provide common data inputs and outputs. Decoupling capacitors are mounted on the module board.