Position: Home  > All Categories> Integrated Circuits (ICs) > HB56D473EJ

HB56D473EJ

Features: · 168-pin socket type package (Dual lead out) -Outline: 133.35 mm (Length)× 25.40 mm (Height)× 9.00 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 60/70 ns (max) tCAC = 20/25 ns (max)· Low power dissipation -Active mode: 12.5/11.3 W (max) -S...

product image

HB56D473EJ Picture
See larger image
SeekIC No. : 004358926 Detail

HB56D473EJ: Features: · 168-pin socket type package (Dual lead out) -Outline: 133.35 mm (Length)× 25.40 mm (Height)× 9.00 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: t...

HB56D473EJ Data Sheet

floor Price/Ceiling Price

Get Latest Price
Part Number:
HB56D473EJ
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

SeekIC Buyer Protection PLUS - newly updated for 2013!

  • Escrow Protection.
  • Guaranteed refunds.
  • Secure payments.
  • Learn more >>

Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/12/25

add to my favourite

Payment Methods

All payment methods are secure and covered by SeekIC Buyer Protection PLUS.

Notice: When you place an order, your payment is made to SeekIC and not to your seller. SeekIC only pays the seller after confirming you have received your order. We will also never share your payment details with your seller.
Product Details

Description



Features:

·  168-pin socket type package (Dual lead out)
     - Outline: 133.35 mm (Length)× 25.40 mm (Height)× 9.00 mm (Thickness)
     - Lead pitch: 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
     - Access time: tRAC = 60/70 ns (max)
     tCAC = 20/25 ns (max)
·  Low power dissipation
     - Active mode: 12.5/11.3 W (max)
     - Standby mode (TTL): 588 mW (max)
     (CMOS): 462 mW (max)
·  Buffered input except RAS and DQ
·  4 byte interleave enabled, dual address input (A0/B0)
·  JEDEC standard outline buffered 8-byte DIMM
·  Fast page mode capability
·  2,048 refresh cycles: 32 ms


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to +7.0
V
Supply voltage relative to VSS
VCC
0.5 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
25
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56D473EJ belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications. The HB56D473EJ is a 4M × 72 dynamic RAM module, mounted 16 pieces of 16-Mbit DRAM (HM5117400) sealed in SOJ package and 8 pieces of 4-Mbit DRAM (HM514100) sealed in SOJ package, 1 pieces of 16- bit BiCMOS line driver (74ABT16244) sealed in TSSOP package and 1 pieces of 20-bit BiCMOS line driver (74ABT16827) sealed in TSSOP package. An outline of the product is 168-pin socket type package (dual lead out). Therefore, it makes high density mounting possible without surface mount technology. It provides common data inputs and outputs. Decoupling capacitors are mounted on the module board.




Customers Who Bought This Item Also Bought

Margin,quality,low-cost products with low minimum orders. Secure your online payments with SeekIC Buyer Protection.
You may also be interested in :
Optoelectronics
SFH7770
TLP423J
Discrete Semiconductor Products
T508N12TOF
MUR20040
Optical Inspection Equipment
AA924
A21K4B
Computers, Office - Components, Accessories
DS-4008HCI
LB104V03(A1)
Cables, Wires
821-0814-a
415-0100-150
Line Protection, Backups
BX0023
A20B-1008-0550
View more