HB56D436BR

Features: · 72-pin single in-line package -Outline: 107.95 mm (Length) × 31.75/25.40 mm (Height)× 9.14 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 60/70ns (max)· Low power dissipation -Active mode: 6.41/5.78 W (max) (HB56D836BR/SBR Series) 6.09/5.4...

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SeekIC No. : 004358924 Detail

HB56D436BR: Features: · 72-pin single in-line package -Outline: 107.95 mm (Length) × 31.75/25.40 mm (Height)× 9.14 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 6...

floor Price/Ceiling Price

Part Number:
HB56D436BR
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·  72-pin single in-line package
     - Outline: 107.95 mm (Length) × 31.75/25.40 mm (Height) × 9.14 mm (Thickness)
     - Lead pitch: 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
     - Access time: tRAC = 60/70ns (max)
·  Low power dissipation
     - Active mode: 6.41/5.78 W (max) (HB56D836BR/SBR Series)
     6.09/5.46 W (max) (HB56D436BR/SBR Series)
     - Standby mode (TTL): 252 mW (max) (HB56D836BR/SBR Series)
     (TTL): 126 mW (max) (HB56D436BR/SBR Series)
     (CMOS): 16.8 mW (max) (L-version) (HB56D836BR/SBR Series)
     (CMOS): 8.4 mW (max) (L-version) (HB56D436BR/SBR Series)
·  Fast page mode capability



Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
1.0 to +7.0
V
Supply voltage relative to VSS
VCC
1.0 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
12
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56D836BR/SBR is a 8M × 36 dynamic RAM module, mounted 16 pieces of 16-Mbit DRAM (HM5117400) sealed in SOJ package and 8 pieces of 4-Mbit DRAM (HM514100) sealed in SOJ package. The HB56D436BR/SBR is a 4M × 36 dynamic RAM module, mounted 8 pieces of 16-Mbit DRAM (HM5117400) sealed in SOJ package and 4 pieces of 4-Mbit DRAM (HM514100) sealed in SOJ package. An outline of the products is 72-pin single in-line package. Therefore, the HB56D836BR/SBR, HB56D436BR/SBR make high density mounting possible without surface mount technology. The HB56D836BR/SBR, HB56D436BR/SBR provide common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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