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HB56D172EJ

Features: • 168-pin socket type package (Dual lead out) - Lead pitch: 1.27 mm• Single 5 V (±5%) supply• High speed - Access time: tRAC = 60/70/80 ns (max) - Access time: tCAC = 20/25/25 ns (max)• Low power dissipation - Active mode: 11.26/10.21/9.16 W (max) - Standby mode: ...

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SeekIC No. : 004358922 Detail

HB56D172EJ: Features: • 168-pin socket type package (Dual lead out) - Lead pitch: 1.27 mm• Single 5 V (±5%) supply• High speed - Access time: tRAC = 60/70/80 ns (max) - Access time: tCAC = 20/...

HB56D172EJ Data Sheet

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Part Number:
HB56D172EJ
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

• 168-pin socket type package (Dual lead out)
   - Lead pitch: 1.27 mm
• Single 5 V (±5%) supply
• High speed
   - Access time: tRAC = 60/70/80 ns (max)
   - Access time: tCAC = 20/25/25 ns (max)
• Low power dissipation
   - Active mode: 11.26/10.21/9.16 W (max)
   - Standby mode: 546 mW (max)
• Buffered input exceptRAS and DQ
• 4 byte interleave enabled, dual address input (A0/B0)
• Fast page mode capability
• 1,024 refresh cycle: 16 ms
• 2 variations of refresh
   - RAS-only refresh
   - CAS-before-RAS refresh
• TTL compatible


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to +7.0
V
Supply voltage relative to VSS
VCC
0.5 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
Pt
21
W
Operating temperature
Topr
0 to +70
Storage temperature
Tstg
55 to +125



Description

The HB56D172EJ belongs to 8 byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 byte processor applications.

The HB56D172EJ is a 1 M ×72 dynamic RAM module, mounted 16 pieces of 4-Mbit DRAM (HM514400CS) sealed in SOJ package and 4 pieces of 2-Mbit DRAM (HM512200BS) sealed in SOJ package and 2 pieces of 16-bit BiCMOS line driver (74ABT16244) sealed in TSSOP package. An outline of the HB56D172EJ is 168-pin socket type package (dual lead out). Therefore, it makes high density mounting possible without surface mount technology. it provides common data inputs and outputs. Decoupling capacitors are mounted beneath each SOJ on the module board.




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