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HB56AW873E

Features: • 168-pin socket type package (Dual lead out) -Lead pitch: 1.27 mm• Single 3.3 V (±0.3 V) supply• High speed -Access time: tRAC = 60/70 ns (max) -Access time: tCAC = 20/23 ns (max)• Low power dissipation -Active mode: 4.73/4.41 W (max) -Standby mode (TTL): 100 mW ...

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SeekIC No. : 004358920 Detail

HB56AW873E: Features: • 168-pin socket type package (Dual lead out) -Lead pitch: 1.27 mm• Single 3.3 V (±0.3 V) supply• High speed -Access time: tRAC = 60/70 ns (max) -Access time: tCAC = 20/2...

HB56AW873E Data Sheet

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Part Number:
HB56AW873E
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

• 168-pin socket type package (Dual lead out)
   - Lead pitch: 1.27 mm
• Single 3.3 V (±0.3 V) supply
• High speed
   - Access time: tRAC = 60/70 ns (max)
   - Access time: tCAC = 20/23 ns (max)
• Low power dissipation
   - Active mode: 4.73/4.41 W (max)
   - Standby mode (TTL): 100 mW (max)
• Buffered input except RAS and DQ
• 4 byte interleave enabled, dual address input (A0/B0)
• Fast page mode capability
• 4,096 refresh cycle: 64 ms
• 2 variations of refresh
   - RAS -only refresh
   - CAS -before-RAS refresh
• TTL compatible


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to +4.6
V
Supply voltage relative to VSS
VCC
0.5 to +4.6
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
10
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56AW873E belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications. It is a 8M ×72 dynamic RAM module, mounted 9 pieces of 64-Mbit DRAM (HM5165800ATT) sealed in TSOP ackage and 2 pieces of 16-bit BiCMOS line driver (74LVT16244) sealed in TSSOP package. An outline of the HB56AW873E is 168-pin socket type package (dual lead out). Therefore, it makes high density mounting possible without surface mount technology. It provides common data inputs and outputs. Decoupling capacitors are mounted beside each TSOP on the its module board.




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