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HB56A840BR

Features: · 72-pin single in-line package -Outline: 107.95 mm (Length) × 25.40 mm (Height) × 9.14/5.28 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 50/60/70ns (max)· Low power dissipation -Active mode: 4.99/4.47/3.94 W (max) (HB56A840BR Series) 4.73...

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SeekIC No. : 004358906 Detail

HB56A840BR: Features: · 72-pin single in-line package -Outline: 107.95 mm (Length) × 25.40 mm (Height) × 9.14/5.28 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 5...

HB56A840BR Data Sheet

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Part Number:
HB56A840BR
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

·  72-pin single in-line package
     - Outline: 107.95 mm (Length) × 25.40 mm (Height) × 9.14/5.28 mm (Thickness)
     - Lead pitch: 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
     - Access time: tRAC = 50/60/70ns (max)
·  Low power dissipation
     - Active mode: 4.99/4.47/3.94 W (max) (HB56A840BR Series)
     4.73/4.20/3.68 W (max) (HB56A440BR Series)
     - Standby mode (TTL): 210 mW (max) (HB56A840BR Series)
     (TTL): 105 mW (max) (HB56A440BR Series)
     (CMOS): 105 mW (max) (HB56A840BR Series)
     (CMOS): 52.5 mW (max) (HB56A440BR Series)
·  Fast page mode capability
·  Refresh period
     - 4096 refresh cycles: 64 ms


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
1.0 to +7.0
V
Supply voltage relative to VSS
VCC
1.0 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
10
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56A840BR is a 8M ×40 dynamic RAM module, mounted 20 pieces of 16-Mbit DRAM (HM5116400) sealed in SOJ package. The HB56A440BR is a 4M × 40 dynamic RAM module, mounted 10 pieces of 16-Mbit DRAM (HM5116400) sealed in SOJ package. An outline of the HB56A840BR, HB56A440BR is 72-pin single in-line package. Therefore, they make high density mounting possible without surface mount technology. They provide common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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