HB56A440BR

Features: · 72-pin single in-line package -Outline: 107.95 mm (Length) × 25.40 mm (Height) × 9.14/5.28 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 50/60/70ns (max)· Low power dissipation -Active mode: 4.99/4.47/3.94 W (max) (HB56A840BR Series) 4.73...

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SeekIC No. : 004358896 Detail

HB56A440BR: Features: · 72-pin single in-line package -Outline: 107.95 mm (Length) × 25.40 mm (Height) × 9.14/5.28 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 5...

floor Price/Ceiling Price

Part Number:
HB56A440BR
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·  72-pin single in-line package
     - Outline: 107.95 mm (Length) × 25.40 mm (Height) × 9.14/5.28 mm (Thickness)
     - Lead pitch: 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
     - Access time: tRAC = 50/60/70ns (max)
·  Low power dissipation
     - Active mode: 4.99/4.47/3.94 W (max) (HB56A840BR Series)
     4.73/4.20/3.68 W (max) (HB56A440BR Series)
     - Standby mode (TTL): 210 mW (max) (HB56A840BR Series)
     (TTL): 105 mW (max) (HB56A440BR Series)
     (CMOS): 105 mW (max) (HB56A840BR Series)
     (CMOS): 52.5 mW (max) (HB56A440BR Series)
·  Fast page mode capability
·  Refresh period
     - 4096 refresh cycles: 64 ms



Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
1.0 to +7.0
V
Supply voltage relative to VSS
VCC
1.0 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
10
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56A840BR is a 8M ×40 dynamic RAM module, mounted 20 pieces of 16-Mbit DRAM (HM5116400) sealed in SOJ package. The HB56A440BR is a 4M × 40 dynamic RAM module, mounted 10 pieces of 16-Mbit DRAM (HM5116400) sealed in SOJ package. An outline of the products is 72-pin single in-line package. Therefore, the HB56A840BR, HB56A440BR make high density mounting possible without surface mount technology. The HB56A840BR, B56A440BR provide common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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