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HB56A272E-5

Features: · 168-pin socket type package (Dual lead out) -Outline: 133.35 mm (Length)× 25.40 mm (Height) × 4.00 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 50/60/70 ns (max) tCAC = 18/20/23 ns (max)· Low power dissipation -Active mode: 5.53/5.06/4.5...

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SeekIC No. : 004358891 Detail

HB56A272E-5: Features: · 168-pin socket type package (Dual lead out) -Outline: 133.35 mm (Length)× 25.40 mm (Height) × 4.00 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: ...

HB56A272E-5 Data Sheet

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Part Number:
HB56A272E-5
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·  168-pin socket type package (Dual lead out)
     - Outline: 133.35 mm (Length) × 25.40 mm (Height) × 4.00 mm (Thickness)
     - Lead pitch: 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
     - Access time: tRAC = 50/60/70 ns (max)
     tCAC = 18/20/23 ns (max)
·  Low power dissipation
     -Active mode: 5.53/5.06/4.59 W (max)
     - Standby mode (TTL): 431 mW (max)
     (CMOS): 383 mW (max)
·  Buffered input except RAS and DQ
·  4 byte interleave enabled, dual address input (A0/B0)
·  JEDEC standard outline buffered 8-byte DIMM
·  Fast page mode capability
·  2,048 refresh cycles: 32 ms
·  2 variations of refresh
     -RAS -only refresh
     - CAS -before-RAS refresh
·  TTL compatible


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to +7.0
V
Supply voltage relative to VSS
VCC
0.5 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
10
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56A272E belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications. The HB56A272E is a 2M × 72 dynamic RAM module, mounted 9 pieces of 16-Mbit DRAM (HM5117800) sealed in TSOP package and 2 pieces of 16-bit BiCMOS line driver (74ABT16244) sealed in TSSOP package. An outline of the HB56A272E is 168-pin socket type package (dual lead out). Therefore, the HB56A272E makes high density mounting possible without surface mount  echnology. The HB56A272E provides common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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