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HB56A232D-5

Features: · 72-pin Zig Zag Dual tabs socket type -Outline: 59.69 mm (Length)× 25.40 mm (Height) × 2.42 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 50/60/70 ns (max) tCAC = 13/15/18 ns (max)· Low power dissipation -Active mode: 2.31/2.10/1.89 W (max...

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SeekIC No. : 004358883 Detail

HB56A232D-5: Features: · 72-pin Zig Zag Dual tabs socket type -Outline: 59.69 mm (Length)× 25.40 mm (Height) × 2.42 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 5...

HB56A232D-5 Data Sheet

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Part Number:
HB56A232D-5
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

·  72-pin Zig Zag Dual tabs socket type
     - Outline: 59.69 mm (Length)× 25.40 mm (Height) × 2.42 mm (Thickness)
     - Lead pitch: 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
     - Access time: tRAC = 50/60/70 ns (max)
       tCAC = 13/15/18 ns (max)
·  Low power dissipation
     - Active mode: 2.31/2.10/1.89 W (max)
     - Standby mode (TTL): 42 mW (max)
       (CMOS): 3.15 mW (max) (L-version)
·  Fast page mode capability
·  Refresh period
     - 2048 refresh cycles: 32 ms
       128 ms (L-version)
·  4 variations of refresh
     -RAS -only refresh
     -CAS -before-RAS refresh
     - Hidden refresh
     - Self refresh (L-version)
·  TTL compatible


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
1.0 to +7.0
V
Supply voltage relative to VSS
VCC
1.0 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
4
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56A232D is a 2M × 32 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 4 pieces of 16-Mbit DRAM (HM5117800) sealed in TSOP package. An outline of the HB56A232D is 72-pin Zig Zag Dual tabs socket type compact and thin package. Therefore, it makes high density mounting possible without surface mount technology. It  provides common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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